ATS-09F-30-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09F-30-C3-R0-ND

Manufacturer Part#:

ATS-09F-30-C3-R0

Price: $ 8.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09F-30-C3-R0 datasheetATS-09F-30-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 7.31934
30 +: $ 6.88861
50 +: $ 6.45813
100 +: $ 6.02759
250 +: $ 5.59705
500 +: $ 5.48941
1000 +: $ 5.38177
Stock 1000Can Ship Immediately
$ 8.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.35°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are one of the most important components in the electronics industry. Heat sinks are mainly utilized to efficiently dissipate heat from electronic components. ATS-09F-30-C3-R0 is a heat sink designed to be used in a variety of applications, ranging from cooling the latest computer processors to cooling the electronics in household appliances. The ATS-09F-30-C3-R0 is an aluminum thermal heat sink with an extruded aluminum base profile of 0.9" x 2.0" x 0.7". It has a pin fin design that provides maximum thermal performance for applications that require a heat sink with its size capability. It offers excellent conductive properties, which enables it to serve as a heat sink in applications that require high power. It also features a high surface area that effectively dissipates the heat from the electronic components.The ATS-09F-30-C3-R0 is a very versatile heat sink that can be used in a variety of applications. It can be used in applications that require cooling of processors, motherboards, graphics cards, and other high power components in computers. It can also be used in consumer electronic applications, such as gaming consoles, TVs, and other consumer electronic products. It is also suitable for a wide range of industries, such as medical, automotive, and industrial.The working principle of the ATS-09F-30-C3-R0 is based on two basic components. First, it uses a pin fin design to provide maximum thermal performance. The pin fin design allows for the heat from the device to be conducted away from the device more efficiently than other thermal designs. Second, the ATS-09F-30-C3-R0 uses a high surface area to provide an effective heat dissipation over a large area. This allows for the heat to be more evenly dissipated across the entire heat sink, which provides efficient cooling of the electronic components.The ATS-09F-30-C3-R0 is an efficient and reliable heat sink that is suitable for a variety of applications. It is lightweight, as well as inexpensive. This makes it a great choice for those who are looking for an effective way to dissipate heat from their electronic components. The ATS-09F-30-C3-R0 is a great addition to any thermal management system and can provide excellent cooling performance.

The specific data is subject to PDF, and the above content is for reference

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