ATS-09F-32-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	21.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal heat sinks are designed to dissipate the heat from electronic components, such as CPUs and GPUs, and help regulate the temperature within an electronic system. Heat sinks are common components that can be found on PCs, laptops, smart phones, and other electronic devices.The ATS-09F-32-C2-R0 is an advanced thermal heat sink specifically designed to provide thermal resistance and increased system performance. It is an ideal component for applications that require long-term reliability and high-performance thermal management.The ATS-09F-32-C2-R0 features an efficient fin design that provides superior heat conduction. This heat sink has been tested to provide higher efficiency and better heat dissipation performance than other comparable models.The ATS-09F-32-C2-R0 is designed to be used in applications such as high-performance computing, industrial computers, automotive applications, server farms, and military applications. It is also suitable for electronics in low-risk environments such as household products and consumer electronics.The ATS-09F-32-C2-R0 features an atomized aluminum construction with anodized black finish. This offers superior corrosion resistance and thermal conductivity. It is designed to withstand temperatures up to 100°C and can be used in high-temperature environments.The ATS-09F-32-C2-R0 has an innovative design that allows it to be mounted directly onto a device, rather than needing to be separate. This eliminates the need for extra hardware and makes installation easier and faster.The working principle of the ATS-09F-32-C2-R0 is based on the principles of heat transfer. Heat from the electronic components of a system is dissipated through a series of fins that line the surface of the heat sink. The fins act as a path for the heat energy, allowing it to transfer into the surrounding environment.The greater the thermal resistance of the heat sink, the more efficient it will be in dissipating heat away from the electronic components while allowing the system to work at peak performance. The ATS-09F-32-C2-R0 offers high levels of thermal resistance, meaning it is highly efficient in dissipating heat away from the electronic components.The ATS-09F-32-C2-R0 is built to last and is designed for repeated reuse. Its construction ensures that it will not degrade due to long-term exposure to heat and other environmental factors.The ATS-09F-32-C2-R0 is a reliable and efficient thermal heat sink that is suitable for use in a variety of applications. Its superior design ensures that it will provide thermal resistance and increased system performance for years to come.

The specific data is subject to PDF, and the above content is for reference