| Allicdata Part #: | ATS16451-ND |
| Manufacturer Part#: |
ATS-09F-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions provide the essential capability of controlling temperatures and dissipation of heat in a range of applications and systems. Heat sinks serve a key role in cooling and thermal regulation by providing a uniform mechanism of dissipating heat from critical system components. The ATS-09F-50-C2-R0 is a thermal heat sink providing an optimal platform for dissipating thermal energy.
The ATS-09F-50-C2-R0 is a two-piece, highly engineered, clamshell-style heat sink. It features a 25mm x 352mm (0.98 x 13.86 in) footprint, and uses a patented system of fin geometry to maximize surface area for the airflow. In addition, the ATS-09F-50-C2-R0 employs two high efficiency fans to maximize the airflow and further improve heat dissipation. The result is a highly efficient heat sink that is capable of dissipating up to 20W of thermal energy.
The ATS-09F-50-C2-R0 heat sink is designed for use in a wide range of applications, including server and networking equipment, computers, automotive electronics, and telecommunications. It can be mounted directly to a circuit board or used in combination with other cooling solutions, such as heat sinks, fanless coolers, and active cooling systems. The ATS-09F-50-C2-R0 is available in a range of sizes and colors, allowing for customization to meet the specific needs of a given application.
The primary working principle of the ATS-09F-50-C2-R0 heat sink is thermoelectricity, which is the transfer of thermal energy through a conductive material. The heat sink employs two high-efficiency fans to circulate air over the evaporator, causing a decrease in temperature in the region where the heat sink has been positioned. The heat absorbed by the heat sink is then transferred to the cooler air in the environment surrounding the heat sink. As a result, the system temperature is reduced and the thermal energy is dissipated safely and efficiently.
The ATS-09F-50-C2-R0 heat sink is an ideal solution for controlling temperatures in sensitive electronic components. It provides an efficient way to disperse heat and helps to maintain a safe operating temperature. The ATS-09F-50-C2-R0 is a reliable choice for thermal management in a range of applications, from computers to automotive electronics.
The specific data is subject to PDF, and the above content is for reference