| Allicdata Part #: | ATS-09F-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components that help regulate temperatures of electrical components by dissipating thermal energy away from the heated parts. The ATS-09F-50-C3-R0 is a type of heat sink designed to provide better cooling performance for electronics with high power requirements. Here, we\'ll take a look at its application field and working principle.
Application Field
The ATS-09F-50-C3-R0 is designed to be used in high-power, high-heat applications, such as servers, routers, laser systems, and other pieces of equipment that require reliable operation under extreme conditions. It\'s aimed at providing better cooling solutions for larger components that would otherwise create hotspots due to the higher power requirements.
This model also features several other characteristics that make it appealing in certain environments. For example, its low thermal resistance makes it more efficient in dissipating heat away from the components, while its lightweight design makes it easier to install into various configurations and enclosures. Additionally, its unique heat spreader technology improves heat conduction while also improving durability.
Working Principle
The ATS-09F-50-C3-R0 is an air-cooled heat sink, meaning that it utilizes air as the cooling medium. When the air comes in contact with the fins on the heat sink, it is cooled, and this helps to dissipate heat away from the components. The large surface area of the fins also helps to increase the efficiency of the cooling process.
The heat sink\'s design also helps to reduce resistance and improve the air flow around the components. This, in turn, creates an environment where the components don\'t get too hot, and thus, are more reliable and durable. Additionally, the heat sink\'s design also makes it more efficient in terms of energy consumption, as no additional energy is needed to cool the components.
The ATS-09F-50-C3-R0 is also designed to be compatible with the majority of mounting systems, making it suitable for a variety of applications. This, in turn, gives electronics designers a more efficient cooling solution that isn\'t too difficult to install.
Conclusion
The ATS-09F-50-C3-R0 is an efficient air-cooled heat sink designed to provide better cooling performance for electronics with high power requirements. It is ideally suited for use in high-power, high-heat applications, such as servers, routers, laser systems, and other pieces of equipment that require reliable operation under extreme conditions. Additionally, this heat sink features several other characteristics that make it appealing in certain environments, such as low thermal resistance, lightweight design, and improved heat spreader technology.
The specific data is subject to PDF, and the above content is for reference