Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.74°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an important component of any modern electronic device. They regulate the temperature of the device by conducting, dissipating, and convecting heat away from vital components. The ATS-09F-52-C1-R0 is an advanced heat sink designed for applications in the industrial market. This article will discuss the application field and working principle of the ATS-09F-52-C1-R0.

Application Field

The ATS-09F-52-C1-R0 is designed for use in industrial applications. It is an ideal solution for providing cooling in environments where power dissipation and/or thermal stress could be an issue. It is especially useful in applications that require high efficiency cooling, such as robotics, green energy, and medical.The ATS-09F-52-C1-R0 is designed to provide a robust cooling solution for CPU, ASIC, and other types of electronics. It is especially suitable for use in harsh environments because of its high heat dissipation capacity and its ability to withstand repeated thermal cycling.

Working Principle

The ATS-09F-52-C1-R0 uses both convection and radiation to reduce the temperature of a component. Convection is the process of transferring heat from a hot area to a cool area due to the natural circulation of air currents. The heat sink has specially designed fins to encourage the circulation of air, which helps to reduce the temperature of the component. The heat sink also takes advantage of radiation, transferring infrared energy from the hot object to the cold surrounding environment. This transfers the heat to the environment and reduces the temperature of the component. The ATS-09F-52-C1-R0 also utilizes a highly efficient heat transfer process known as “spreader plate technology”. This technology is designed to increase the surface area of the heat sink to encourage better heat transfer. This helps to reduce the temperature of the component more quickly and efficiently. The ATS-09F-52-C1-R0 also utilizes a unique design that allows for easy installation. The heat sink is designed to fit into tight spaces, allowing it to be installed in difficult to access areas. It also features an adjustable mounting surface which makes installation easier and faster.

Conclusion

The ATS-09F-52-C1-R0 is an advanced heat sink designed for industrial applications. It utilizes both convection and radiation to dissipate heat from the component, as well as spreader plate technology to increase the heat sink’s surface area. Additionally, the heat sink is designed for easy installation in tight spaces. These features make it an ideal solution for providing effective cooling in any electronic system.

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