| Allicdata Part #: | ATS-09F-53-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-53-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-53-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.63195 |
| 30 +: | $ 3.43014 |
| 50 +: | $ 3.22837 |
| 100 +: | $ 3.02665 |
| 250 +: | $ 2.82487 |
| 500 +: | $ 2.62310 |
| 1000 +: | $ 2.57265 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are commonly used to enhance the performance of electrical components, and the ATS-09F-53-C3-R0 is no exception. The ATS-09F-53-C3-R0 is a type of thermal-heat sink designed to efficiently dissipate heat while providing cooling to sensitive components.
The ATS-09F-53-C3-R0 has a range of application fields. Oftentimes, it is used in conjunction with processors, voltage regulators, and other electronics that require active cooling. It is also a great choice for cooling fans, as it is capable of dispersing heat quickly and more effectively than traditional metallic heat sinks. Additionally, the ATS-09F-53-C3-R0 is commonly used in high-powered LED lights and electronics that require intensive amounts of energy.
Despite its small size, the ATS-09F-53-C3-R0 has a robust construction that provides exceptional heat spreading capabilities and is resistant to deformation. The heat sink’s efficient cooling system is based on several design elements. First, it is composed of an aluminum fin stack connected to a copper base material. This combination allows for improved heat dissipation, as aluminum is an excellent thermal conductor, while copper is renowned for its efficient heat distribution capabilities.
Furthermore, the ATS-09F-53-C3-R0 features a unique extrusion design. This means that during the manufacturing process, aluminum is forced into a mold containing a predetermined shape. This shape helps to create a greater surface area, allowing air to flow more freely around the fins and thus more efficiently dissipate heat. The ATS-09F-53-C3-R0 also features multiple air intake holes to ensure that air can flow freely around the fins, ensuring a more efficient cooling process.
The ATS-09F-53-C3-R0’s installation process is also relatively simple and straightforward. It is designed to be connected directly to a PCB, using the included mounting accessories. This allows for a secure fit and improved thermal performance. Additionally, due to its small size, the ATS-09F-53-C3-R0 can easily be placed in almost any type of enclosure.
In conclusion, the ATS-09F-53-C3-R0 is a high-performance thermal-heat sink designed to provide efficient cooling while occupying minimal spaֲce. Its unique design elements, such as the aluminum fin stack and the extrusion process, provide superior heat transferring abilities and ensure that sensitive components remain cool even during prolonged periods of use. It can be easily connected to a PCB, making it a great choice for a variety of applications requiring active cooling.
The specific data is subject to PDF, and the above content is for reference