| Allicdata Part #: | ATS-09F-71-C1-R0-ND |
| Manufacturer Part#: |
ATS-09F-71-C1-R0 |
| Price: | $ 4.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-71-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.84048 |
| 30 +: | $ 3.62691 |
| 50 +: | $ 3.41347 |
| 100 +: | $ 3.20015 |
| 250 +: | $ 2.98680 |
| 500 +: | $ 2.77346 |
| 1000 +: | $ 2.72012 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential element of any electronic system design, and heat sinks are essential components to enable efficient cooling and manage temperatures to help ensure the system’s safe and stable operation. ATS-09F-71-C1-R0 is one such product in the thermal heat sink range, and it offers an efficient cooling solution with its effective combination of design and materials.
Heat Sink Design and Materials
The ATS-09F-71-C1-R0 heat sink is a machined component made of aluminium. It features a particular combination of dimensions and design features including fin heights of 9mm, fin lengths of 71mm and a total fin surface area of 11.46 cm². These features help to increase the intensity of the air-to-heat transfer, leading to improved efficiency of the system.
In addition, the heat sink also features an offset flat fin structure, which helps to increase the surface area without increasing the overall size of the component. This makes the ATS-09F-71-C1-R0 an ideal choice for applications where space is limited.
Application Field and Working Principle
The ATS-09F-71-C1-R0 is suitable for applications such as CPU cooling in desktop computers and other small electronic systems, and can be used to manage temperatures efficiently. The heat sink works by dissipating heat away from the heat source (such as a CPU), and dissipating it into the air surrounding the component via its aluminum fins.
The heat sink also features a large contact area between its fins and the heat source, allowing efficient heat transfer. This leads to improved dissipation of heat compared to smaller heat sinks, meaning that it can handle higher temperatures.
In addition, it is also possible to attach additional cooling components such as fans to the ATS-09F-71-C1-R0, thereby enhancing cooling performance and enabling the system to operate within a broader range of temperatures.
Conclusion
The ATS-09F-71-C1-R0 heat sink is an effective cooling solution for any electronic system design, providing efficient cooling performance thanks to its design and materials, as well as the ability to add additional cooling components such as fans. As such, it is an ideal choice for applications such as CPU cooling and other small electronic systems.
The specific data is subject to PDF, and the above content is for reference