| Allicdata Part #: | ATS-09F-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09F-72-C3-R0 thermal heat sink is designed to handle the physical heat produced from components during normal operation. By controlling this heat, it maximizes the performance and longevity of the components and helps ensure that the system operates reliably.
Heat sinks differ from standard thermal components such as heaters because they don’t actively produce heat themselves. Instead, heat sinks rely on convective and radiative thermal processes to passively disperse heat generated by other systems. This makes them ideal for applications where minimizing the amount of heat produced is critical.
As its name suggests, the ATS-09F-72-C3-R0 thermal heat sink is made up of two major components: the base and the plate. The base is the foundation on which the plate is attached. The plate is the actual heat-dissipating section of the heat sink, and it is composed of several fins.
These fins provide a large surface area for the air to flow over, transferring heat away from the component and into the surrounding environment. The base is made of a metal material that is highly conductive of heat. This ensures that heat is efficiently channeled away from the components and into the fins and base.
The ATS-09F-72-C3-R0 provides optimum cooling performance for a wide range of applications. It is designed to handle up to 100 watts of heat, making it suitable for even the most powerful components. It is also highly durable, with a long life expectancy in even the most difficult operating environments.
Due to its impressive thermal performance, the ATS-09F-72-C3-R0 is an ideal solution for both active and passive cooling. It is commonly used in applications such as CPUs, GPUs, computer enclosures, and storage devices, and it can also be used for industrial applications, such as avionics, automotive, and defense systems.
In addition to its thermal shielding capabilities, the ATS-09F-72-C3-R0 also provides several other benefits. It is made from lightweight materials, which makes it easy to install and relocate if necessary. It is also designed to minimize noise production and vibration, making it suitable for noise-sensitive applications. Furthermore, its aesthetically pleasing design means that it is well-suited to visual-centric applications.
The ATS-09F-72-C3-R0 is a versatile and reliable thermal heat sink that is specifically designed for high-performance cooling. Its impressive thermal performance, durability, and lightweight design make it ideal for a variety of applications. Whether you’re looking for cooling solutions for IT, industrial, or consumer products, the ATS-09F-72-C3-R0 has you covered.
The specific data is subject to PDF, and the above content is for reference