| Allicdata Part #: | ATS-09F-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09F-75-C3-R0 is a type of thermal-heat sink, a device used to enable better management of the temperature within an area or workstation. Heat sinks are devices designed to dissipate the heat generated from a range of electrical and mechanical elements, enabling more efficient performance and extended component life.
The ATS-09F-75-C3-R0 is composed of a four-fin aluminum extrusion that is manufactured exclusively from high grade aluminum material. This allows for superior heat transfer capability, providing reliable and effective cooling performance. The thermal fins are connected to a heat sink base with a specifically designed aluminum clip to maximize contact area. This provides a secure bond and aggressive heat dissipation.
The ATS-09F-75-C3-R0 is widely used in a variety of applications including power, process and communications related industries. The heat sink features a rugged and low profile design that is ideal for installations in hard to reach spaces as well as providing the user with an easy to install and effective heat sink. Furthermore, the ATS-09F-75-C3-R0 is also capable of dissipating high amounts of heat in various small form factor applications.
The ATS-09F-75-C3-R0 is designed to fit a range of processor temperatures from 60 degrees Celsius up to 70 degrees Celsius. It is specifically designed with an efficient direct thermal contact construction. This ensures maximum surface area and thermal transfer rate between components and the sink for more effective heat distribution.
The ATS-09F-75-C3-R0 utilizes a three-segment cooling process. It first absorbs the heat from the processor and then disperses it via a heat sink base to the thermal fins. This is then repeated via a thermally conductive metal interface to ensure maximum thermal transfer. The thermal fins then act as a radiator to dissipate the heat via moving air or fans.
In order to ensure both stability and efficiency, the ATS-09F-75-C3-R0 also features a patented two-way thermal blocking technology. This allows for maximum heat dispersion without blockage, as well as the potential for higher performance in cooling. Additionally, the heat sink is made with an advanced bonding method which provides a secure and reliable connection between the heat sink and components for long term stability and efficiency.
The ATS-09F-75-C3-R0 is an ideal solution for buyers who require an effective thermal-heat sink solution with a long-term lifespan. It is a quality device that offers a reliable and cost-effective approach to managing extreme temperatures. With its design and features, the ATS-09F-75-C3-R0 is the perfect choice for those who require an effective heat management solution.
The specific data is subject to PDF, and the above content is for reference