| Allicdata Part #: | ATS-09F-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-09F-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09F-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics has become a paramount concern in modern times. With ever-increasing energy demands, advanced consumption rates, and a continuous drive for innovation and development on electronic components, proper thermal design has become more and more critical in order to achieve optimal performance from electronic devices and systems. Heat sinks are one of the most widely used tools for addressing these thermal requirements. The ATS-09F-81-C3-R0 heat sink is one such device that utilizes a variety of technologies to improve the overall thermal performance of a system.
The ATS-09F-81-C3-R0 is a high-performance, low-profile heat sink designed for efficient heat dissipation. It is constructed of aluminum and features multiple spines, or fin plates, on its surface with a specially engineered thermal spreader located on the base of the device. This combination of features allows for maximum air convection and in turn, improved overall thermal performance. In addition, its compact size and lightweight design make it an ideal choice for use in applications where space is limited.
The ATS-09F-81-C3-R0 is designed to work in two primary ways. First, it is designed to remove excess heat from electronic components via convection. This is accomplished by the flow of air passing across the spines of the heat sink which then causes a decrease in temperature on the component’s surface. As the surface temperature of the electronic component decreases, transfer of heat away from the component is also improved.
The second primary method of operation of the ATS-09F-81-C3-R0 is to force air through the specially designed thermal spreader located on the base of the device. This design helps to create a layer of air that acts as an insulator and prevents heat from radiating back up from components attached below the heat sink. Coupled with the convection cooling provided by the spines, this ensures that all components retain their optimal temperatures and that no unnecessary heat is generated.
The combination of these two cooling methods provided by the ATS-09F-81-C3-R0 makes it an ideal choice for applications where reliability, efficiency, and cost-effectiveness are key concerns. It is also a great option for applications that require consistent thermal management and/or do not have dedicated cooling systems. It is even suitable for applications requiring redundant thermal management as it is often used as part of a tiered cooling approach.
The ATS-09F-81-C3-R0 is a reliable, cost-effective and efficient thermal solution designed for the needs of modern electronics. Its combination of features makes it an excellent choice for a variety of applications, ranging from personal desktops to military and aerospace equipment. With its user-friendly design and optimal performance, the ATS-09F-81-C3-R0 is an ideal heat sink for any application.
The specific data is subject to PDF, and the above content is for reference