| Allicdata Part #: | ATS-09G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-09G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are increasingly being used in a wide array of applications to improve efficiency and performance of electronic components. The ATS-09G-10-C1-R0 is one of the latest developments in the Thermal-Heat Sink field. This article will explain the application field as well as the working principle of the ATS-09G-10-C1-R0.
Applications of the ATS-09G-10-C1-R0 primarily include LED cooling and EMC components. The unit is designed for use in high-temperature applications, such as high-power LED and energy-saving devices that require a high level of heat dissipation. The ATS-09G-10-C1-R0 is able to dissipate an impressive amount of heat in a compact form factor, making it an ideal choice for LED cooling and EMC component installations. Additionally, the product is also used in light emitting diode (LED) lighting applications, providing reliable and stress-free LED heat dissipation.
The ATS-09G-10-C1-R0 operates using a combination of thermal diffusing and air flow construction. The Thermal Diffusing Construction (TDC) is a unique design feature of the ATS-09G-10-C1-R0, which provides efficient heat transfer between the cold and hot plate of the unit. The unit also employs a unique air flow construction, which distributes air evenly over the hot plate in a circular pattern to evenly distribute the heat.
The air flow property of the ATS-09G-10-C1-R0 ensures that efficient heat dissipation is maintained while minimizing pressure drop. The air flow construction also reduces the risk of thermal shock by allowing heat to escape swiftly. The ATS-09G-10-C1-R0 also features a high performance heat sink, which helps to improve the unit\'s efficiency and effectiveness in heat transfer.
Overall, the ATS-09G-10-C1-R0 is an excellent choice for LED cooling and EMC component installations due to its efficient heat transfer and air flow properties. The unit is also designed for use in high-temperature applications and offers reliable and stress-free LED heat dissipation. Its efficient TDC and air flow design also helps to improve the unit\'s performance and reduce the risk of thermal shock. With its improved design, the ATS-09G-10-C1-R0 is the perfect solution for almost any thermal-heat sink application.
The specific data is subject to PDF, and the above content is for reference