| Allicdata Part #: | ATS-09G-100-C1-R0-ND |
| Manufacturer Part#: |
ATS-09G-100-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-100-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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, result.htmlThe ATS-09G-100-C1-R0 is a type of thermal heat sink, which is designed to be used in various electronic hardware components to dissipate thermal energy away. The most common application would be within LED lights as the high powered LEDs require more heat to be dissipated away from the electronics and its components. This thermal heat sink can also be used with computer chips and processors, and can even be used on larger scale electrical circuit boards requiring additional cooling.
The ATS-09G-100-C1-R0 is made from a durable and flexible aluminum alloy that is designed to perform even in extreme conditions. Its design reduces the possibility of thermal breakdown by enabling efficient thermal energy transfer away from the heat-producing components, making it an ideal heat sink for many applications. It also helps improve the overall efficiency of components by increasing heat dissipation.
The heat dissipating function of the ATS-09G-100-C1-R0 is achieved between two layers: an aluminum inner layer and a copper fin outer layer. When the heat is applied by the hardware components, the aluminum inner layer absorbs the thermal energy. This thermal energy is then dissipated into the copper fin outer layer, which further dissipates the heat away from the hardware components. This two-layer cooling system enables rapid heat dissipation, reducing the possibility of thermal overload or failure.
The ATS-09G-100-C1-R0 thermal heat sink can also be used in applications beyond LED components such as power supplies, transformers, motor drivers, and other electronic circuit boards. It is also well suited to be used in areas with varying temperatures, as its aluminum alloy is able to withstand extreme temperatures ranging from -40℃ to +220℃. The flexibility of this heat sink also allows it to be used in difficult to reach areas and tight spaces, making it an ideal choice for many applications where space and weight are issues.
In summary, the ATS-09G-100-C1-R0 is a high-performance thermal heat sink that can be used in various electronic components to dissipate thermal energy away effectively. Its two-layer cooling system reduces the possibility of thermal breakdown, while its aluminum alloy allows it to withstand a wide range of temperatures. Furthermore, its flexibility and lightweight design make it an ideal choice for tight spaces and hard to reach areas. With its durable and efficient performance, the ATS-09G-100-C1-R0 is an excellent solution for any application where thermal energy needs to be dissipated.
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