ATS-09G-11-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09G-11-C1-R0-ND

Manufacturer Part#:

ATS-09G-11-C1-R0

Price: $ 3.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09G-11-C1-R0 datasheetATS-09G-11-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.06684
30 +: $ 2.98431
50 +: $ 2.81849
100 +: $ 2.65268
250 +: $ 2.48686
500 +: $ 2.40397
1000 +: $ 2.15528
Stock 1000Can Ship Immediately
$ 3.37
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.77°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-09G-11-C1-R0 is a type of thermal-heat sink, which is a device designed to dissipate energy in the form of heat. In simpler terms, it is used to cool down any type of device or system by transferring the heat energy away from its source. These heat sinks then disperse it throughout the surrounding environment through the process of convection or radiation.

The ATS-09G-11-C1-R0 is a specially designed heat sink with an impressive combination of performance and efficiency. It has a unique design that allows for maximum heat dissipation and optimal cooling efficiency. This heat sink is made from high-grade aluminum and is capable of dispersing heat energy up to five times faster than a standard model. This makes it perfect for applications where rapid cooling is required.

The ATS-09G-11-C1-R0 is mainly used in computer electronics, such as CPUs or GPUs. It is also used in more demanding applications such as in high-performance gaming systems. The heat sink’s low-profile design makes it ideal for tight spaces, and its relatively low weight makes it easy to install. Additionally, its attractive finish makes it aesthetically pleasing, resulting in improved system performance.

The ATS-09G-11-C1-R0 relies on several key principles in order to achieve its impressive thermal performance. First, its design facilitates the rapid and efficient transfer of thermal energy from the device being cooled to the heat sink itself. This is achieved by utilizing efficient fins and a large surface area, which provide a larger area for the transfer of heat energy. Secondly, the heat sink is designed in such a way that it facilitates the efficient dispersal of that energy to the surrounding environment. This is accomplished through the process of convection, which is the movement of a gas or liquid due to the thermal gradient. Finally, the aluminum construction of the heat sink helps to improve its heat dispersion characteristics, allowing it to cool down more quickly.

Overall, the ATS-09G-11-C1-R0 makes for an excellent thermal-heat sink due to its superior performance and efficiency. Its low-profile design and lightweight construction make it ideal for tight spaces and easy installation, while its durable aluminum construction ensures that it will remain effective for a long time. In addition, its ability to quickly disperse heat energy makes it great for applications in which rapid cooling is essential. With all of these factors taken into consideration, the ATS-09G-11-C1-R0 is a great choice for cooling down any device or system.

The specific data is subject to PDF, and the above content is for reference

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