| Allicdata Part #: | ATS-09G-127-C1-R0-ND |
| Manufacturer Part#: |
ATS-09G-127-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-127-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A Thermal - Heat Sink (THS) is a device used for transferring heat from one area to another. THS devices are essential components in many electronic and mechanical systems as they help to maintain low system temperatures that are necessary for ideal performance. The ATS-09G-127-C1-R0 is one such THS device that is suitable for various applications.
The ATS-09G-127-C1-R0 is a small THS device that is designed for small-sized integrated circuit components. It is an all-in-one THS solution that does not require additional power or fan. The device features a high-performance pressure-sensitive adhesive backing material and excellent thermal conductivity of approximately 2 W/mk. The device has a size of 9.0 x 7.3 x 1.27 mm and a weight of 0.15g. The THS is also designed to be low-profile and cost-effective.
The ATS-09G-127-C1-R0 is used for applications such as dissipating heat from small size integrated circuits (ICs) and miniaturization of electrothermal processes. The device can also be used for thermal management in various consumer electronics, such as laptops, cell phones, digital cameras and medical devices. The high-performance adhesive backing allows the device to have a secure and stable mount. The low thermal resistance and low profile design of the device allows for a more efficient heat transfer.
The primary working principle of the ATS-09G-127-C1-R0 is based on the idea of dissipating heat. The heat is generated by the electric current passing through the circuit board or IC. This heat is then dissipated through the THS device into the surrounding environment. The device uses a thermally conductive material to dissipate the heat. The material is designed with a high thermal conductivity to ensure that the heat is transferred quickly and efficiently.
The ATS-09G-127-C1-R0 is an effective THS device that is suitable for various applications. The device features a small size, high-performance pressure-sensitive adhesive backing material and excellent thermal conductivity. The device is also designed to be low-profile, cost-effective and suitable for dissipating heat from small size integrated circuits. The primary working principle behind the device is based on dissipating heat into the surrounding environment, with the assistance of a thermally conductive material. The device is an ideal solution for thermal management in various consumer electronics.
The specific data is subject to PDF, and the above content is for reference