| Allicdata Part #: | ATS-09G-143-C3-R0-ND |
| Manufacturer Part#: |
ATS-09G-143-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-143-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal management components that dissipate heat generated by electronic devices. They can be used to cool any device that transmits and dissipates heat, such as processors, transistors, motors, and other electronic components. The ATS-09G-143-C3-R0 is a type of heat sink, specifically designed for cooling processor-based applications.
The ATS-09G-143-C3-R0 is a thermally efficient heat sink that is designed to draw heat away from processors, helping to protect them from overheating. It is constructed from an aluminum alloy and has a surface area that is optimized to maximize its cooling capabilities. The sink also features a re-flow pad, which helps to spread out the heat across its entire surface, helping to reduce the temperature of nearby components.
In addition to its thermal performance, the ATS-09G-143-C3-R0 has several other features that make it well suited for use in processor-based applications. It is designed with a compact profile, making it easy to install in confined spaces. It is also lightweight, so it can be easily moved around as needed. The sink also features an anti-corrosive coating, which helps to protect it from environmental damage and wear.
The ATS-09G-143-C3-R0 is generally used in applications that require higher thermal performance than can be achieved with a passive heat sink. This makes it well suited for applications such as high-power video cards, motherboards, and CPUs that generate a lot of heat. The sink can be easily installed on existing or new processor-based systems with just a few screws or mounting clamps.
The ATS-09G-143-C3-R0 works by dissipating heat from the processor through a combination of conduction and convection. As the heat sink absorbs heat from the processor, it dissipates it to the surrounding air. This helps to reduce the temperature of the processor, ensuring that it remains within its safe operating temperature. The re-flow pad also helps to spread out the heat across the entire surface of the heat sink, increasing its effectiveness.
Overall, the ATS-09G-143-C3-R0 is an excellent choice for cooling processor-based applications that require higher thermal performance. Its compact size, lightweight design, and corrosion resistance make it a great choice for common processor applications. The sink is also easy to install and is highly effective at dissipating heat, ensuring that your processor remains within its safe operating temperature.
The specific data is subject to PDF, and the above content is for reference