| Allicdata Part #: | ATS-09G-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-09G-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-09G-170-C1-R0 Thermal - Heat Sinks
ATS-09G-170-C1-R0 is an advanced thermal heat sink designed to dissipate heat efficiently and effectively. This specific heat sink has a unique arrangement of cooling fins that increase the surface area for heat exchange. The design ensures that the highest amount of heat can be dissipated with the least amount of material.
The first component in the ATS-09G-170-C1-R0 is the base plate. This is a flat sheet of metal that supports the weight of the device and provides a flat and stable surface for assembly. The base plate also provides an attachment point for the heat pipes, which are conductive pipes that enable the transfer of heat away from the device into the heat sink.
The second component is the thermal fins. The fins are a series of thin metal plates which are staggered in order to create a larger surface area for heat exchange. By creating more surface area, the heat sink can dissipate more heat than a heatsink with less fins. The fins are arranged in an angle so that the airflow from the fan is evenly spread over the entire surface, ensuring that the most amount of heat is removed.
The fan in the ATS-09G-170-C1-R0 is responsible for circulating the air across the surface of the heatsink. This circulation helps to dissipate the heat faster and more efficiently. The fan also helps to reduce noise levels, as the fan can be adjusted to provide the optimum cooling performance without causing too much noise.
The metal plates and fins of the ATS-09G-170-C1-R0 are designed to absorb and dissipate the heat when it is transferred from the device. As the heat is evacuated from the device, it is conducted through the heat sink and fins, where it is cooling down rapidly. This process of cooling and dissipating heat is the working principle of the heat sink.
The ATS-09G-170-C1-R0 is designed to be used in a variety of applications, including computer processors, high-performance GPUs, server platforms, and telecommunications equipment. The heat sink is also ideal for thermal management in medical devices, aerospace applications, and datacenters. It can be used to effectively cool down sensitive components in harsh environments, such as in a high-temperature or moisture-rich environment.
The specific data is subject to PDF, and the above content is for reference