| Allicdata Part #: | ATS-09G-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-09G-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
In today’s world of high-performance electronics, thermal management is a critical factor for any device. Dissipating heat away from the electronics is essential in order for them to operate at their peak efficiency. That’s where heat sinks come in. ATS-09G-20-C1-R0 heat sinks are designed to work in a passive cooling system, helping to spread the heat over a larger surface area, and dissipating it into the ambient air.
What is ATS-09G-20-C1-R0?
ATS-09G-20-C1-R0 is a compact heat sink made from extruded aluminum. It features a unique design featuring thick and thin fins, which are arranged to maximise surface area and airflow. This helps to quickly and efficiently dissipate heat from electronic components. It also features a die-cast aluminum base, which further increases the heat dissipation rate. This helps to keep the electronic components cool, thereby increasing their lifetime and performance.
Application Field
Since heat sinks are designed to travel heat away from electronic components, they are often used in the high-performance electronics industry. These include processors, GPUs, and other types of ICs. Due to its compact size and high-performance, ATS-09G-20-C1-R0 heat sinks are commonly used in a variety of consumer electronics, such as laptops, tablets, and gaming consoles. Its die-cast aluminum base also makes it a cost-effective solution for automotive, aviation, and defense applications.
Working Principle
Heat sinks work on the principle of thermodynamics. Heat transfers from hotter objects to colder ones. So, when an electronic component gets hot, it transfers some of its heat energy to the surrounding air, and some to the heat sink. The heat sink dissipates the heat energy into the ambient air, thus keeping the electronic component cool.
Conclusion
In conclusion, ATS-09G-20-C1-R0 heat sinks are designed for high-performance cooling applications. They are ideal for use in consumer electronics, computers, and other types of electronic components. In addition to their excellent cooling performance, they are also cost-effective and durable, making them a great choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference