| Allicdata Part #: | ATS-09G-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-09G-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to dissipate heat from components that generate a lot of heat, such as high-powered computer processors and industrial machinery. The ATS-09G-27-C3-R0 is a type of heat sink specifically designed to optimally dissipate heat in a variety of applications. This article will discuss the application field and working principle of the ATS-09G-27-C3-R0 thermal-heat sink.
The ATS-09G-27-C3-R0 is a high performance, low profile, compact extrusion-based copper heat sink. Its small size and improved surface area-to-volume ratio make it an ideal choice for applications where space is at a premium. It has a low thermal resistance of 0.14°C/W, making it capable of dissipating large amounts of heat. This makes it suitable for applications such as data centers, computer processors, gaming consoles, communication systems, industrial motor control systems, and power supplies.
The ATS-09G-27-C3-R0 features a passive cooling system that uses convection to dissipate heat. It has an integrated heatsink base and extruded aluminum fins that work together to create an efficient cooling system. In this system, the heatsink base acts as a thermal bridge between the heat source and the aluminum fins, allowing heat to be transferred more efficiently to the fins. The heat is then transferred to the surrounding air via convection. This helps reduce the temperature of the heat source, thus keeping it in an optimal operational temperature range.
To further increase its cooling capability, the ATS-09G-27-C3-R0 features a patented Self-Healing alloy plating process. This process creates an oxidation-resistant layer of metal that helps dissipate heat more efficiently. The layer also prevents oxidation of the heat sink’s surface, thus reducing the need for frequent cleaning and maintenance. Additionally, its compact design makes it easy to install in tight spaces and its low profile maximizes compatibility in various applications.
Furthermore, the ATS-09G-27-C3-R0 features an optimized mounting system for easy installation. It has four mounting holes which makes it easy to attach the heat sink to various components. The thermal interface material used also helps reduce installation time and provide excellent thermal performance. This helps reduce the overall cost associated with the setup of a cooling system.
In conclusion, the ATS-09G-27-C3-R0 thermal-heat sink is an excellent choice for a variety of applications due to its high performance, low profile, and compact design. Its integrated heatsink base and extruded aluminum fins work together to create an efficient cooling system which helps reduce the temperature of the heat source keeping it in an optimal range. Additionally, its unique Self-Healing alloy plating process, optimized mounting system, and low profile design provide excellent thermal performance at an affordable price.
The specific data is subject to PDF, and the above content is for reference