| Allicdata Part #: | ATS-09G-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-09G-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential in many industrial applications due to the heat generated by the process. Heat sinks are one of the most commonly used thermal management components. They are designed to dissipate heat away from the source, aiding in maintaining steady operation temperatures. The ATS-09G-30-C3-R0 heat sink is one such component.
The ATS-09G-30-C3-R0 has an overall length of 30mm and an overall width of 9mm, which makes it suitable for a range of applications where a small heat sink is required. The component includes an internal fin array which is designed to maximize thermal performance. This fin array also allows for quick and easy installation, as it requires no special tools or mounting systems.
The ATS-09G-30-C3-R0 has been designed to operate in a wide range of environments and temperatures. It is rated to handle up to 150W of power, and can work efficiently in temperatures ranging from -50°C to +80°C. This makes it suitable for applications with higher temperature variations.
The ATS-09G-30-C3-R0 heat sink is also designed to provide excellent surface-to-air thermal transfer. This allows for heat to be moved away from the source quickly and efficiently. The heat sink features a black anodized finish, which provides excellent corrosion protection and greater thermal performance.
The ATS-09G-30-C3-R0 heat sink’s working principle is simple. Heat generated by the electronic device is turned into thermal energy, which is then dissipated through the internal fin array and away from the device. The fin array optimizes the thermal transfer process by maximizing the area available for the thermal energy to be discharged. This helps to keep the operating temperature of the electronic device at a steady level.
Due to its small size and excellent thermal performance, the ATS-09G-30-C3-R0 heat sink can be used in a range of applications. It is suitable for applications such as HVAC, medical equipment, automotive electronics, and consumer electronics. In these applications, the ATS-09G-30-C3-R0 can help to efficiently dissipate heat away from sensitive electronic components.
The ATS-09G-30-C3-R0 heat sink is an ideal choice for thermal management in applications where a small heat sink is required. Its surface-to-air thermal transfer capabilities allow for efficient thermal transfer, and its black anodized finish helps to enhance corrosion protection and performance. With its wide operating temperature range, it is suitable for many different applications.
The specific data is subject to PDF, and the above content is for reference