ATS-09G-63-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

The ATS-09G-63-C2-R0 is a device designed to help dissipate heat generated by electrical components. It is used primarily in embedded systems and other devices where increased cooling is necessary. It is designed to effectively transfer heat away from its source and to a less-populated external environment.The ATS-09G-63-C2-R0 consists of a metal frame with multiple fins along its surface. These fins are made of an aluminum material, which allows them to effectively dissipate the heat generated. The fins act as mini radiators, transferring the heat away from the electrical components and out into the atmosphere.The ATS-09G-63-C2-R0 is mounted on the component in one of two ways. It can either be attached directly to the component or it can be mounted on a separate heat sink. When mounted directly on the component, it helps to provide a higher levels of heat transfer from the component to the fins. When mounted on a separate heat sink, it acts as an effective buffer, reducing the temperature of the component before it reaches the fins.The ATS-09G-63-C2-R0 works by taking the heat generated by the component and dissipating it through its fins. As the fins heat up, they transfer the heat to the atmosphere, thus helping to cool the component. The aluminum material of the fins also has excellent thermal conductivity, allowing it to efficiently absorb and transfer heat away from the component.To ensure that the ATS-09G-63-C2-R0 works effectively, it should be installed correctly and securely. It should be mounted firmly onto the component and the fins should be properly aligned so that they can effectively transfer the heat away. This will help maximize the cooling efficiency of the device and ensure that the component does not overheat.The ATS-09G-63-C2-R0 is a useful device for keeping electronic components cool in embedded systems and other devices. Its aluminum fins are designed to effectively transfer the heat away from the component and into the atmosphere. When installed correctly, the device can provide an excellent level of thermal transfer and help prevent the component from overheating.

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