| Allicdata Part #: | ATS-09G-88-C3-R0-ND |
| Manufacturer Part#: |
ATS-09G-88-C3-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09G-88-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.52800 |
| 30 +: | $ 3.33186 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components in electronic systems. They extend the life of sensitive circuits by helping to dissipate heat generated during operation. ATS-09G-88-C3-R0 is an example of a thermal-heat sink designed to offer superior thermal performance. The features of this heat sink, as well as its application field and working principle, are discussed here.
Technical Features
The ATS-09G-88-C3-R0 is a premium thermal-heat sink solution for electronics cooling. The design features a lot of stability and robustness components, leading to superior performance. The parts are made from aluminum to promote better heat dissipation to the surrounding air. Additionally, the use of a unique contact surface contributes to improved heat transfer capacity. Furthermore, an integral heat spreader allows for maximum energy efficiency and thermal insulation.
Application Field
This heat sink is a suitable solution for a wide range of applications. It is especially effective in applications where there is limited space for cooling components. It is also ideal for large projects requiring high cooling efficiency. Examples of these include computing devices, medical equipment, and consumer electronics. Furthermore, by applying this heat sink, it is possible to reduce system temperatures by up to 10%.
Working Principle
The primary working principle of the ATS-09G-88-C3-R0 is based on the use of natural thermal convection. Through its unique contact surface, the heat sink encourages the movement of air around the components it cools. As air rises away from the heat sink, it takes with it the heated air generated from the components and dissipates it into the surrounding environment. By doing so, the heat sink effectively reduces the temperatures of interior components within the system.
Benefits
The key benefit of the ATS-09G-88-C3-R0 is its ultra-low profile, which allows for a low-profile installation of the heat sink. It also offers superior cooling performance, allowing users to free up more space for other components. The heat sink is also available in two different sizes, offering further flexibility with installation. Furthermore, the use of an integral heat spreader allows for excellent heat dissipation with minimal power consumption. This makes the heat sink ideal for energy-efficient systems.
Conclusion
The ATS-09G-88-C3-R0 is a thermal-heat sink with superior thermal performance. Its design allows for efficient heat dissipation through natural convection. It is suitable for a wide range of applications, from computers to medical devices. The heat sink is also available in two different sizes, enabling it to fit into tight spaces. With its low profile and high energy efficiency, the ATS-09G-88-C3-R0 is a great choice for applications requiring superior thermal performance.
The specific data is subject to PDF, and the above content is for reference