
Allicdata Part #: | ATS16700-ND |
Manufacturer Part#: |
ATS-09H-02-C2-R0 |
Price: | $ 3.69 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X12.7MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.35790 |
10 +: | $ 3.26907 |
25 +: | $ 3.18100 |
50 +: | $ 3.00422 |
100 +: | $ 2.82744 |
250 +: | $ 2.65074 |
500 +: | $ 2.56237 |
1000 +: | $ 2.29730 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.500" (12.70mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 18.32°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks, also known as heat spreaders, are essential for thermal management in electrical and electronic equipment. The ATS-09H-02-C2-R0 is a low profile heat sink that utilizes high thermal conductivity to provide economical and reliable cooling of high-power components. This heat sink features an innovative design, which allows for greater flexibility when installing in various application environments.
The ATS-09H-02-C2-R0 is designed for applications in which a low profile is required to achieve an optimal thermal performance. It follows a two-dimensional design structure, which helps ensure a low profile with minimal external components. The flat top surface supports a broad range of components up to a maximum power rating of 0.5 watts. The anodized aluminum base provides excellent thermal conductivity and durability, making the ATS-09H-02-C2-R0 an ideal solution for high-power parts used in consumer electronics, automotive, medical, industrial, and military applications.
The design of the ATS-09H-02-C2-R0 also makes it the perfect choice for use in surface mount applications. Its slim profile allows for quick and easy installation in tight spaces. The internal fin structure, paired with the heat dissipation channels, promotes effective heat transfer to maintain the safe operation of high-power components. The integrated heat spreaders can be easily removed so that the device can be mounted in both standalone and different multi-chip configurations. This feature makes the ATS-09H-02-C2-R0 highly versatile and suitable for a wide range of applications.
The ATS-09H-02-C2-R0 provides an efficient, dependable, and cost-effective solution for controlling temperatures in multiple types of devices. It features an internal fin and cooling channel structure, which helps dissipate heat quickly and evenly from the high-power components. The flat top plate acts as a base, which allows components to be mounted securely on the heat sink. This design leads to improved thermal performance and longer component life. For applications that require a low profile or require additional thermal capacity, the ATS-09H-02-C2-R0 can also be combined with a fan to further reduce temperatures.
The ATS-09H-02-C2-R0 is an excellent choice for many applications that require reliable cooling. Its innovative design and top-notch performance make it the perfect choice for high-power components, while its low profile allows for quick and easy installation in tight spaces. The anodized aluminum base provides excellent thermal conductivity and durability, making it suitable for use in both commercial and industrial applications. With its versatile features and cost-effective solution, the ATS-09H-02-C2-R0 is a great choice for cooling high-power components.
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