| Allicdata Part #: | ATS16716-ND |
| Manufacturer Part#: |
ATS-09H-107-C2-R1 |
| Price: | $ 5.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-107-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.67460 |
| 10 +: | $ 4.54545 |
| 25 +: | $ 4.29332 |
| 50 +: | $ 4.04069 |
| 100 +: | $ 3.78813 |
| 250 +: | $ 3.53559 |
| 500 +: | $ 3.28304 |
| 1000 +: | $ 3.21991 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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When it comes to managing the temperature of sensitive electronics components, thermal and heat sinks can provide a solution. The ATS-09H-107-C2-R1 is a fan-cooled heat sink designed for use with higher power semiconductor components. It offers excellent cooling performance in a lightweight, space-saving package.
The ATS-09H-107-C2-R1 is a fan-cooled radiator with an integrated heat exchanger. It is constructed of aluminum radiating fins with an offset fan to reduce air turbulence. The fan is designed to move the air over the fins at high speed, cooling the components inside the heat sink. Heat is extracted from the component and dissipated into the atmosphere by the radiator fins.
The ATS-09H-107-C2-R1 is ideal for applications where space is limited and cooling requirements are high. It is easy to install and requires minimal maintenance, making it a cost-effective choice for applications such as data centers, telecom systems, medical equipment, and automotive electronics.
The ATS-09H-107-C2-R1 is a reliable and efficient cooling solution that can help protect sensitive components from damage caused by excessive heat. It offers a range of benefits, including improved durability, increased thermal performance, and reduced noise levels. The fan design helps ensure air is moved over the fins efficiently, resulting in improved cooling performance.
The working principle of the ATS-09H-107-C2-R1 is simple. As the fan rotates, it draws air in through the intake grille and over the fins of the heat sink. This air is then expelled out the exhaust grille, carrying away excess heat from the electronics components. The fan is designed to create airflow that is more efficient than most other heat sinks, resulting in higher performance and better cooling.
As an added benefit, the ATS-09H-107-C2-R1 is incredibly reliable. It is made from durable materials that can withstand long-term use and is designed to resist dust, dirt, and other contaminants. This ensures it is capable of providing reliable cooling for years to come. Additionally, the fan is designed with a long life in mind, helping to reduce replacement costs.
In conclusion, the ATS-09H-107-C2-R1 is a fan-cooled heat sink that offers excellent cooling performance for high power semiconductor components. It is an effective and reliable thermal solution that is easy to install and requires minimal maintenance. The fan design helps ensure air is moved over the fins efficiently, resulting in improved cooling performance. The ATS-09H-107-C2-R1 is ideal for applications where space is limited and cooling requirements are high, making it a cost-effective choice for a range of applications.
The specific data is subject to PDF, and the above content is for reference