| Allicdata Part #: | ATS-09H-141-C1-R0-ND |
| Manufacturer Part#: |
ATS-09H-141-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-141-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an important area of research within the electronics manufacturing sector. As components become more complex and diverse, the need for effective heat sinks to control the spread of heat generated by computer processors is increasingly necessary. The ATS-09H-141-C1-R0 is a heat sink designed to provide efficient cooling solutions to meet the needs of modern machinery. This article looks at the application fields and working principle of the ATS-09H-141-C1-R0.
The ATS-09H-141-C1-R0 is a heat sink designed to provide efficient cooling solutions for a variety of machinery. It is specifically designed for use in humidity controlled environments such as data processing and communications systems. The ATS-09H-141-C1-R0 can also be used in military and industrial applications, such as in telecommunications towers and power stations. Because of its rugged construction, the ATS-09H-141-C1-R0 is also suitable for outdoor applications.
The ATS-09H-141-C1-R0 is manufactured from aluminium and features corrugated fins to optimize heat transfer. It also features a patented \'curved louver\' design which enables the accommodation of unevenly placed components on the motherboard, and it is compatible with 1U (44mm) or 2U (88mm) fan systems. It has an operating temperature range of -5oC to 50oC, and a storage temperature range of -20oC to 70oC.
The ATS-09H-141-C1-R0 works by dissipating heat generated by electronic components away from the components. This is done by conduction, convection and radiation. The aluminium construction of the ATS-09H-141-C1-R0 helps to conduct heat away from the components, and the corrugated fins aid in maximising the surface area of the sink to help the heat transfer process. The ATS-09H-141-C1-R0 also uses a patented fan system to help improve the rate of air flow, and this helps to improve the convection process. Finally, the curved louver design aids in the radiation process.
The ATS-09H-141-C1-R0 has several advantages over other types of thermal management solutions. It is lightweight and has a small footprint, meaning it can fit into tight spaces. The aluminium construction is durable and corrosion resistant, making it ideal for long term use in harsh outdoor conditions. It is also relatively inexpensive, making it a cost-effective solution. The ATS-09H-141-C1-R0 is also easy to install and maintain, providing a hassle-free thermal management solution.
The ATS-09H-141-C1-R0 is a high quality and efficient thermal management solution that is suitable for a wide range of applications. With its rugged construction and easy installation, it is ideal for use in industrial, military and outdoor applications. It is also an affordable solution that is designed to provide reliable cooling solutions for data processing and communication systems.
The specific data is subject to PDF, and the above content is for reference