| Allicdata Part #: | ATS-09H-165-C3-R0-ND |
| Manufacturer Part#: |
ATS-09H-165-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-165-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of electrical and electronic systems and components to ensure optimal performance, reliability, and longevity. Heat sinks are one of the most effective means of cooling electronic components efficiently. The introduction of ATS-09H-165-C3-R0 thermal management solution extends the traditional concept of heat sinks and cooling systems with its combination of exceptional performance and cost efficiency.
ATS-09H-165-C3-R0 is a forced air-cooling natural convection system to dissipate heat from high powered electronic components. This device is an industrial-grade air-cooled cooling system which is highly suitable for industrial and specialized applications. It has a superior design and has excellent thermal performances due to its sophisticated heat sink design and fan cooling system.
The device features a patented Triton ™ technology to ensure optimum heat dissipation and uniform cooling profile. An important feature of the ATS-09H-165-C3-R0 is its high thermal conductivity, which ensures efficient cooling even when the device is operated at higher temperatures and power levels. The design also ensures low acoustic noise levels.
The device is constructed using aluminum material which offers excellent mechanical performance while providing light weight and excellent thermal capabilities. The heat sink fins are strategically arranged, and provide a higher rate of surface area for more efficient heat transfer. This results in significant improvement in cooling performance at any operation temperature.
The device is supplied with a fan cooling system which further enhances the cooling performance. This fan operates at relatively low noise levels and is designed to be highly effective even in high temperature environment. The fan ensures uniform cooling over all components in the device. Furthermore, the fan also provides additional load reduction, which further reduces the power consumption of the device.
The ATS-09H-165-C3-R0 thermal management solution is highly suitable for a wide range of applications including power supplies, servers, lighting applications, medical equipment, and industrial automation systems. The device is also suitable for a range of other thermal management projects such as automotive and aerospace applications.
In conclusion, the ATS-09H-165-C3-R0 thermal management solution is an advanced, reliable, and highly efficient solution to protect and manage electronic components in a wide range of applications. It features an exclusive combination of superior performance and cost efficiency, which results in improved system reliability, flexibility, and thermal management performance.
The specific data is subject to PDF, and the above content is for reference