ATS-09H-168-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The thermal management of modern electronic devices has become ever more complex as new generations of devices move to higher power densities. Heat sinks, one of the most important components of thermal management systems, are required to provide efficient heat transfer from the component generating the heat to the surrounding airflow. The ATS-09H-168-C3-R0 heat sink is one such product from Advanced Thermal Solutions, Inc. (ATS) that has been designed to meet the ever-increasing demands in thermal management. The ATS-09H-168-C3-R0 heat sink is an extruded aluminum product, constructed from high-grade aluminum extrusions with anodic oxide protection to ensure long life and resistance to corrosion. The fins on the heat sink are arranged in a unique inverted V arrangement to achieve maximum surface-to-air contact and a high degree of directional airflow. This ensures superior thermal performance when used with a thermally conductive component.The ATS-09H-168-C3-R0 heat sink is specifically designed for use with Augat power transistors, or any other semiconductor devices that require a thermal solution. The advanced design of the heat sink ensures that adequate heat dissipation is achieved, even in high heat density applications. The lightweight aluminum construction also ensures that the unit is easy to install and does not require complex support structures.The ATS-09H-168-C3-R0 heat sink is supplied with a mounting bracket to allow secure attachment to the device requiring thermal dissipation. This bracket also allows for adjustment of the orientation of the heat sink fins, helping to optimize airflow and heat dissipation when the device is in operation.In addition to the mounting bracket, the ATS-09H-168-C3-R0 heat sink can also be mounted with the provided 2x4 hardware for direct attachment to casing or a heatsink plate. This allows for greater flexibility in installation and thermal dissipation, as well as providing a more secure mount.The working principle of the ATS-09H-168-C3-R0 heat sink is based on the principles of convection. Heat from the source, in this case the semiconductor device, is transferred to the air passing over the fins of the heat sink. This heat is then dissipated from the air and releases into the atmosphere, allowing the heat to be quickly and efficiently removed from the device.The ATS-09H-168-C3-R0 heat sink has been designed to provide superior thermal performance for a range of applications. Its lightweight design makes it extremely easy to install and its unique fin configuration provides excellent heat transfer from the device to the surrounding air. This makes the ATS-09H-168-C3-R0 a cost-effective and efficient solution for a variety of thermal management challenges.

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