| Allicdata Part #: | ATS-09H-22-C1-R0-ND |
| Manufacturer Part#: |
ATS-09H-22-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-22-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management within electronic systems has become increasingly important, and efficient cooling solutions have become a major focus of research and development efforts. Heat sinks are one of the most common methods of limiting the amount of heat generated by electronic components. ATS-09H-22-C1-R0 is a compact and high-performance heat sink which is designed to dissipate even the highest heat loads at the most demanding situations.
The ATS-09H-22-C1-R0 heat sink utilizes a unique fin design that helps to increase the rate of heat dissipation while ensuring a low thermal resistance. This heat sink features an integrated fin spacing which helps to maximize the efficiency of the heat spreader. Additionally, the heat sink features a compact design, which helps to ensure easy installation and to accommodate the smaller form factors of modern electronic components.
The ATS-09H-22-C1-R0 is designed to provide optimal thermal performance, and is suitable for a wide range of applications. It is an ideal choice for applications such as embedded systems, telecommunications, industrial automation, industrial computing, power management devices, and data centers. The heat sink can also be used in high temperature and high power applications, such as LED drivers. The heat sink also features a rugged design with an insulated base and locking clip to ensure a secure and robust connection.
The ATS-09H-22-C1-R0 heat sink is engineered to be highly efficient in terms of its heat dissipation capability. The heat sink utilizes innovative technology to ensure that the temperature rise is minimized, and that the highest heat loads are effectively dissipated. The heat sink features an improved fin design with a compact and durable base plate. This ensures that the thermal performance is optimized, making the ATS-09H-22-C1-R0 heat sink suitable for a wide range of applications.
The ATS-09H-22-C1-R0 Heat sink also features an integrated fan system which helps to increase the overall thermal performance. The fan draws hot air away from the heat sink and exhausts it outside the system, thus providing a balanced temperature for the heat sink and the electronic components. The fan is also designed to be quiet and reliable, and is independently tested to ensure optimal performance.
The ATS-09H-22-C1-R0 heat sink is also designed to be an environmentally friendly and cost-effective solution. It is RoHS compliant and utilizes recycled packaging. The heat sink is designed to be easy to install without the need for tools, and the mounting hardware is provided with the heat sink.
In conclusion, the ATS-09H-22-C1-R0 heat sink is a highly efficient and reliable thermal management solution for a wide range of applications. With its innovative design and integrated fan system, the heat sink can effectively dissipate even the highest heat loads. The heat sink is also designed to be environmentally friendly and cost-effective, making it a great choice for any application.
The specific data is subject to PDF, and the above content is for reference