ATS-09H-43-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksThermal management is an important consideration when designing electronic systems and devices. Heat generated by electrical and electronic components can reduce the performance of components and systems. In some extreme cases, it can even cause system breakdown. Thermal management of electronic systems requires the efficient transfer of heat away from the system components. This allows the components to operate at their preferred temperature and with optimal performance.Heat sinks are a thermal management device used to transfer and dissipate heat away from system components quickly and efficiently. Heat sinks are commonly used on the processor, voltage regulation module, memory module, storage drive, graphic card, and other components that generate high amounts of heat. The ATS-09H-43-C1-R0 is a heat sink designed for thermal management of high performance components. This article will explore the application field and working principle of the ATS-09H-43-C1-R0.Application Field The ATS-09H-43-C1-R0 heat sink is suitable for multiple applications including power amplifiers, compact LED lighting, laptops, artificial intelligence (AI), active devices, and other applications. It is capable of dissipating large amounts of heat efficiently and quickly so that system components can operate safely and without damage. It is designed to be used in combination with an active cooler, allowing for greater heat dissipation.The ATS-09H-43-C1-R0 is also well-suited for use in data centers, server rooms, and other high-performance computing (HPC) applications. It can be used to cool common components such as processors, memory modules, storage devices, graphics cards, and more. By dissipating heat efficiently and quickly, it can reduce system temperature and improve performance.Working Principle The ATS-09H-43-C1-R0 is designed with an array of multiple cooling fins, allowing it to dissipate more heat compared to traditional heat sinks. The cooling fins are arranged in two staggered rows, allowing air to pass through more easily, while increasing the surface area for heat dissipation. The fins have 0.4mm holes for optimized air permeability, increasing the cooling performance. In addition, the ATS-09H-43-C1-R0 is specially designed with a high-performance heat pipe. The heat pipe is used to efficiently transfer heat away from system components and into the heat sink. It is made of high-quality aluminum and copper, allowing the heat pipe to be more effective in dissipating heat. The ATS-09H-43-C1-R0 also features an additional active cooler to enhance cooling capability. Active coolers such as fans, pumps, and thermal electric coolers are commonly used to help dissipate heat even more effectively. By adding an active cooler to the ATS-09H-43-C1-R0 heat sink, thermal management performance can be further improved, resulting in better system performance. ConclusionThe ATS-09H-43-C1-R0 is a high-performance heat sink designed for thermal management of system components. It is capable of dissipating large amounts of heat quickly and efficiently, allowing components to run safer and cooler. The ATS-09H-43-C1-R0 is suitable for multiple applications such as power amplifiers, compact LED lighting, laptops, AI, active devices, and more. In addition, it is well-suited for use in data centers, server rooms, and other HPC applications. By combining its efficient heat transfer and cooling fins with an active cooler, the ATS-09H-43-C1-R0 can significantly improve thermal management performance and system performance.

The specific data is subject to PDF, and the above content is for reference