| Allicdata Part #: | ATS16850-ND |
| Manufacturer Part#: |
ATS-09H-53-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-09H-53-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are highly specialized devices that transfer heat from one object or material to another. The ATS-09H-53-C2-R0 is a highly efficient, single-grommet aluminum heatsink designed to dissipate heat quickly and effectively. This type of heatsink is used in a variety of applications, from industrial and commercial to home applications, and is especially popular in electronics-related products and operations.
The ATS-09H-53-C2-R0 is a two-stage, double-sided finned heatsink. The fins are spaced in a grid pattern, allowing for maximum surface area of contact with the air. The fins are connected to two aluminum bases that sit on top of a metal core. The core is then sandwiched between two thermally conductive materials to ensure efficient heat transfer. The fins and cores are held together with an epoxy resin and are designed to spread heat out evenly.
The ATS-09H-53-C2-R0 is an ideal choice for applications that require high-efficiency heat transfer. It is designed to absorb and dissipate heat faster than traditional heat sinks and is able to withstand temperatures up to 150°F. This type of heatsink is perfect for cooling down electronics-related products, including processors, graphics cards, and memory modules. It is also ideal for use in industrial applications, such as circuit boards, as well as for automotive applications.
The working principle of the ATS-09H-53-C2-R0 is based on convection and radiation. The metal core in the center of the heatsink acts as a heat sink, absorbing heat from the source and then transferring it through the fins to the air. The two aluminum bases also act as heat sinks, transferring heat away from the source and dispersing it into the surrounding air. The convection of air, which occurs when heat is transferred from the ATS-09H-53-C2-R0 to the air, is also used to cool the air, making it more effective. Additionally, the radiative properties of the heatsink help dissipate heat away from the source, resulting in better thermal management.
The ATS-09H-53-C2-R0 is an excellent choice for all kinds of heat dissipation applications, and is especially well-suited for cooling electronics-related products and operations. It has a low profile design and is compact enough to fit in tight spaces. It is also easy to install and can be used with a variety of cooling solutions. With its efficient heat transfer capabilities, the ATS-09H-53-C2-R0 is one of the best Heat Sinks available on the market today.
The specific data is subject to PDF, and the above content is for reference
ATS-09H-53-C2-R0 Datasheet/PDF