ATS-09H-59-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.08°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-09H-59-C3-R0 Thermal - Heat Sink Application Field and Working Principle

The ATS-09H-59-C3-R0 thermal - heat sink is a component that is responsible for dissipating heat away from critical areas of an electric device. It is designed to absorb, transfer and dissipate heat quickly and efficiently. Due to its versatility, ATS-09H-59-C3-R0 is one of the most commonly used components in the industry for a variety of applications.The ATS-09H-59-C3-R0 is a heat dissipater that is primarily used in electronics such as computers, servers, and communications equipment. It is made from a combination of material such as metal, ceramic and fabrics that are designed to efficiently absorb and dissipate heat quickly. The component is designed with an integrated metal fins to provide maximum surface area that helps dissipate the heat away from the critical areas.The working principle of the ATS-09H-59-C3-R0 Thermal - Heat Sink is quite simple. First, it absorbs the heat generated by the electronic device. As the heat is generated, it is then transferred to the component via thermal conduction. Once the heat is transferred to the component, the heat is then dissipated away from the critical areas by the integrated metal fins.In the world of electronics, efficient cooling is key. Excessive heat can cause critical components to fail, resulting in costly damages or replacements. With the ATS-09H-59-C3-R0, the user is ensured that their device will remain in working order and have a longer life span due to its efficient thermal management.The component can be used in a variety of applications such as computers, servers, communications equipment, medical equipment, and even some types of industrial machinery. It is also widely used in a variety of consumer electronics such as smartphones, tablets, and wearable devices.The ATS-09H-59-C3-R0 is an efficient heat sink due to its seamless design and materials which enable it to rapidly dissipation heat. Additionally, the component has a broad operating temperature range and can operate between -70°C to +150°C, making it suitable for a wide range of applications and temperature conditions.The heat sink is mounted onto the component using specialized mounts. The mounting mechanism allows the component to be tightly secured onto the component, while still enabling for efficient heat dissipation. This is particularly useful for mobile or wearable devices, where space is a major limitation.The ATS-09H-59-C3-R0 offers the user a reliable and efficient thermal solution. Its advanced design and durable construction allows it to be used in a variety of applications and operate in a wide range of temperatures. With its ability to quickly dissipate heat away from critical areas, it ensures that the device will remain in optimal working condition and have a prolonged lifespan.

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