| Allicdata Part #: | ATS16866-ND |
| Manufacturer Part#: |
ATS-09H-69-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-69-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is one of the most important aspects of electronics, as it can directly impact the performance and reliability of electronic devices. Heat sinks are an essential part of thermal management, as they are designed to transfer heat away from important components in order to protect them from damage caused by excessive heat. The ATS-09H-69-C2-R0 heat sink is a high-performance aluminum device designed to provide superior thermal performance for a variety of applications.
The ATS-09H-69-C2-R0 heat sink is a feature-rich device that offers a number of advantages over other thermal management solutions. This device is constructed from high-grade aluminum, which is highly efficient at dissipating heat. The device also features a unique finned design, which allows for improved convection cooling performance compared to other flat-surfaced designs. Additionally, the device is both lightweight and highly durable, making it ideal for a variety of applications.
The ATS-09H-69-C2-R0 is designed to be used in a wide range of applications. This includes applications such as: data processing centers, storage facilities, and telecommunications centers. Additionally, this heat sink is designed to work extremely well with air-cooling systems, which are becoming increasingly popular thanks to their low cost and ease of installation. This device can also be used in conjunction with fan-cooled systems, allowing users to tailor their cooling solutions to their specific needs.
The ATS-09H-69-C2-R0 works on a simple and effective principle. Heat is generated by the electronic components and is then conducted through the aluminum body of the heat sink. The surface area of the fins of the heat sink then increases the surface area available for heat dissipation, allowing for much more efficient cooling performance. As the temperature of the device increases, the fins become hotter and more efficient at dissipating heat.
The ATS-09H-69-C2-R0 is an excellent thermal management choice for many applications. Thanks to its lightweight design, highly efficient cooling performance, and compatibility with a variety of cooling systems, the device is an ideal choice for those looking for a reliable and cost-effective cooling solution. With its high-quality construction, this device is sure to provide reliable performance for a long time to come.
The specific data is subject to PDF, and the above content is for reference