| Allicdata Part #: | ATS-09H-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-09H-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09H-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks, as their name implies, serves to control thermal energy and soften the peaks in thermal resistance. Utilizing sophisticated engineering designs, they reduce the amount of heat generated by electronic components, protect the components, and make the system as a whole more efficient. ATS-09H-72-C3-R0 is one such device.
A simple description of the device’s design and functioning reveals that it is a low-profile heatsink. It is made up of a black anodized base that provides excellent thermal conductivity. It is equipped with an aluminum alloy finned panel, a concave aluminum all-aluminum fan frame, and comes with an optional fan clip mount. Its thermal resistance is based on the low-profile design as well as the choice of material.
Its application field is diverse. It is particularly useful in applications where there is an elevated ambient temperature (in comparison to the allowed temperature limit for the application). In such cases, the low-profile design of the ATS-09H-72-C3-R0 helps reduce thermal resistance, providing constant cooling. It is also suitable for applications where there is a requirement to maintain low profile, such as embedded modules, small form factor computers, heat dissipators, and mobile devices.
The working principle of the heatsink is based on simple physics. Thermal energy is conducted from the heatsink’s base to the finned panel and then conducted from the fins to the air. This helps regulate the temperature of the components placed beneath the heatsink and ensure maximum thermal efficiency. Additionally, its aluminum alloy casing and anodized base ensure a good thermal conductivity and keep the entire assembly cool.
The ATS-09H-72-C3-R0 by Thermal-heat sinks is an excellent solution for low profile applications seeking to dissipate thermal energy efficiently. Its design features, materials, and working principle make it an invaluable tool for electronic applications. Whether it’s embedded modules, small form factor computers, or any other application, the ATS-09H-72-C3-R0 is a perfect choice and ensures thermal stability and efficiency.
The specific data is subject to PDF, and the above content is for reference