ATS-09H-97-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are specialized extruded aluminum accessories used to improve long-term system performance and design flexibility. ATS-09H-97-C2-R0 is a high performance heat spreader with excellent thermal properties and reliable installation. It is designed for improved component stability in high-temperature electronic packages with a variety of mounting options and thermal controller compatibility. This article will discuss the application field and working principle of ATS-09H-97-C2-R0.

Application Field

ATS-09H-97-C2-R0 heat spreader is suitable for use in a wide range of electrical and electronic applications such as cooling of high-performance ICs, power switching modules, memory modules, processors and other high-density electrical components. It is designed for use in commercial and industrial applications where high thermal conductivity, low thermal resistance, and ideal thermal management performance are essential.The thermal properties of ATS-09H-97-C2-R0 provide superior thermal transfer and temperature uniformity. The full-length pre-applied adhesive layer ensures a reliable installation and lasting bond to the component substrate. The ATS-09H-97-C2-R0 also features integrated mounting posts, providing improved heat sink installation and removal performance while eliminating the need for additional fixtures and fasteners.

Working Principle

The thermal performance of ATS-09H-97-C2-R0 is based on high-performance fin-to-heat spreader interface technology. The proprietary fin-to-heat spreader interface design provides greatly improved thermal connection between the heat spreader and the component substrate, allowing for improved heat transfer to the ambient environment and reduced temperature gradient across the electronic package. The ATS-09H-97-C2-R0 provides long-term reliable performance and thermal uniformity.The ATS-09H-97-C2-R0 also integrates a thermal controller designed to regulate the temperature and reduce the temperature difference between the heat spreader and the component substrate. The controller can be triggered to turn on and off at pre-defined temperatures and allows for precise control of the temperature within the package. This ensures stable and reliable operation over the life of the component.

Conclusion

ATS-09H-97-C2-R0 is a highly efficient heat spreader with outstanding thermal performance due to its proprietary fin-to-heat spreader interface technology. Its integrated thermal controller provides accurate temperature control over the component lifespan, ensuring reliable operation and improved system performance. ATS-09H-97-C2-R0 is suitable for a wide range of electrical and electronic common applications, making it an ideal choice for thermal management solutions.

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