Allicdata Part #: | ATS1402-ND |
Manufacturer Part#: |
ATS-1039-C2-R0 |
Price: | $ 8.79 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X38X15MM BRASSPUSHPIN |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-1039-C2-R0 Datasheet/PDF |
Quantity: | 92 |
1 +: | $ 7.98210 |
10 +: | $ 7.53921 |
25 +: | $ 7.09604 |
50 +: | $ 6.65255 |
100 +: | $ 6.20903 |
250 +: | $ 5.76551 |
500 +: | $ 5.65464 |
1000 +: | $ 5.54377 |
Series: | maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Push Pin |
Shape: | Rectangular, Angled Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.500" (38.10mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.50°C/W @ 300 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Green Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are key to helping ensure that devices and systems featuring continuous operation are operating properly, even under difficult conditions. The ATS-1039-C2-R0 is one such solution, providing exceptional performance through three principal features: lightweight construction, robust design and an aggressive heat dissipation profile.
The ATS-1039-C2-R0 is a highly efficient rear-wall-mounted heat sink designed to provide outstanding heat dissipation from both sides of the device. This symmetrical, split-body design ensures efficient thermal dissipation from both sides, reducing overall thermal resistance by nearly 20% compared to traditional designs. It also helps to keep components cool during operation and ensure reliable operation even at high temperatures.
The lightweight construction of the ATS-1039-C2-R0 makes it ideal for applications where space is at a premium, such as those found in IT, telecommunications and consumer electronics designs. The robust design also lends itself to prolonged and protracted operation - something that the ATS-1039-C2-R0 is particularly adept at. Its anodized aluminum construction is engineered to withstand high temperatures and resistance to environmental and operational loads.
What sets ATS-1039-C2-R0 apart from other thermal management solutions, however, is the aggressive heat dissipation profile. This is made possible through the patented fin-shape design and the use of a combination of aluminum, magnesium and other alloys. The anodized aluminum construction dramatically increases heat dissipation on both sides of the device, reducing overall thermal resistance by up to 80%. Furthermore, the combination of aluminum and other alloys allows for wider temperature operation and rapid heat dissipation.
The ATS-1039-C2-R0 has been designed to provide superior performance and reliable operation in any environment. From high performance IT installations, to consumer electronics and telecommunications, it is the perfect solution for any application requiring outstanding thermal management. With its lightweight construction, robust design and aggressive heat dissipation profile, the ATS-1039-C2-R0 provides superior performance in any thermal management challenge. Its anodized aluminum body provides exceptional thermal resistance, while the fin-shape design and combination of aluminum, magnesium and other alloys enables rapid and efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference