ATS-1041-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1407-ND

Manufacturer Part#:

ATS-1041-C1-R0

Price: $ 7.53
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 41X45X10MM NYLONPUSHPIN
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-1041-C1-R0 datasheetATS-1041-C1-R0 Datasheet/PDF
Quantity: 100
1 +: $ 6.84810
10 +: $ 6.46884
25 +: $ 6.08807
50 +: $ 5.70767
100 +: $ 5.32709
250 +: $ 4.94661
500 +: $ 4.85147
1000 +: $ 4.75635
Stock 100Can Ship Immediately
$ 7.53
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Push Pin
Shape: Rectangular, Angled Fins
Length: 1.610" (40.89mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 300 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Green Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal Heat Sinks are widely used to dissipate heat from electronic components in order to maintain their safe operating temperature. The ATS-1041-C1-R0 heat sink is a popular type of thermal heat sink and is used to cool a variety of devices such as computers, servers, power amplifiers, and audio amplifiers. In this article, we\'ll take a look at the application field and working principle of the ATS-1041-C1-R0 heat sink.

The ATS-1041-C1-R0 heat sink is constructed of a combination of aluminum and copper materials to provide maximum cooling efficiency. It is designed to dissipate heat from electrical components at higher operating temperatures. The thermal conductive material is composed of a large amount of thin metal fins to increase air flow and draw heat away from the component. The fins are spaced closely together to maximize the heat exchange area. Additionally, the use of a fan can further increase this thermal performance.

Depending on the size and performance requirements, the ATS-1041-C1-R0 heat sink can be varied in size from 1x1 inch to 15x15 inches. It also comes in a variety of shapes and sizes to fit most application needs, such as staggered, diamond, and round. The ATS-1041-C1-R0 can also be adapted for a wide variety of cooling conditions, including liquid cooling.

The ATS-1041-C1-R0 is designed to provide efficient cooling for components within its application range of -55°C to 125°C. The aluminum base provides an effective thermal barrier for the fins, which allows the fins to dissipate heat more quickly and efficiently. The efficiency of this heat sink is further increased by the use of a fan that can be attached to the base of the heat sink. The fan draws air across the fins to increase their cooling performance.

The ATS-1041-C1-R0 also features an advanced heat sink dielectric. This unique dielectric material not only enhances the heat sink’s ability to dissipate heat but also prevents electrical discharge from occurring. This is especially important in applications where high voltages or currents are present.

Finally, the ATS-1041-C1-R0 has a low profile and is lightweight, making it easy to integrate into a wide range of applications. This feature ensures that the heat sink is not an obstruction and that it can be mounted in tight spaces. The heat sink is also easy to install and comes pre-assembled with thermal paste for immediate use.

Overall, the ATS-1041-C1-R0 heat sink is an ideal choice for cooling a variety of electronic components. Its combination of superior cooling efficiency, dielectric protection, small size, and lightweight make it perfect for a wide range of applications. Whether you need a heat sink for a computer, server, power amplifier, or audio amplifier, the ATS-1041-C1-R0 is an excellent choice.

The specific data is subject to PDF, and the above content is for reference

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