Allicdata Part #: | ATS1495-ND |
Manufacturer Part#: |
ATS-1098-C1-R0 |
Price: | $ 6.62 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | 1/4 BRICK HEATSINK 58X37X6.1MM |
More Detail: | Heat Sink Quarter Brick DC/DC Converter Aluminum ... |
DataSheet: | ATS-1098-C1-R0 Datasheet/PDF |
Quantity: | 45 |
1 +: | $ 6.01650 |
10 +: | $ 5.85270 |
25 +: | $ 5.52762 |
50 +: | $ 5.20241 |
100 +: | $ 4.87727 |
250 +: | $ 4.55210 |
500 +: | $ 4.22695 |
1000 +: | $ 4.14565 |
Series: | maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Quarter Brick DC/DC Converter |
Attachment Method: | Bolt On |
Shape: | Rectangular, Angled Fins |
Length: | 2.283" (58.00mm) |
Width: | 1.457" (37.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.240" (6.10mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 12.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Gold Anodized |
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Thermal management is critical to the success of any electronic component. Heat sinks are designed to conduct heat away from the electronic component. The ATS-1098-C1-R0 is an example of a thermal-heat sink designed for this purpose. In this article, we will discuss the application field and working principle of the ATS-1098-C1-R0.
The ATS-1098-C1-R0 is a single-piece heat spreader for use in thermal management applications. It is a high-performance, low-profile heat sink with good thermal conductivity and excellent heat dissipation. The product is made of high-grade aluminum and has a thickness of only 0.075" (1.905 mm). The product has a rounded outer profile which reduces turbulent air flow, increases heat dissipation and reduces fan noise.
The ATS-1098-C1-R0 is designed for use in a wide range of thermal management applications, such as LED lighting, home audio equipment, automotive electronics, and other devices that require efficient cooling. The product is also suitable for use in high wattage power supplies, helium cooled systems, and integrated circuit cooling systems. The product provides excellent thermal conductivity and greatly reduces heat accumulation in electronic component assemblies.
The ATS-1098-C1-R0 utilizes a thermally conductive, hydrophobic, adhesiveless material for its thermal interface. The material consists of an aluminum substrate with a chemically etched copper metallization for effective thermal conductivity. The adhesiveless material provides superior thermal transfer properties, minimizing both contact resistance and thermal resistance to ambient air. The thermal interface material also helps to reduce surface stress on the device. The product is designed to be easy to install and does not require any additional thermal pads or material.
The ATS-1098-C1-R0 also includes an integrated fan shroud, which helps to direct the air flow to the heat sink’s fins and further increase cooling efficiency. The fan shroud also helps to reduce fan noise and reduce the overall noise level of the system. The product also includes a built-in fan guard, which helps to prevent accidental contact with any moving parts.
The ATS-1098-C1-R0 is the perfect choice for a wide range of thermal management applications. Its low-profile design and excellent thermal transfer properties make it ideal for high-heat applications. Its adhesiveless interface material makes it easy to install and provides superior thermal conductivity. The product also offers an integrated fan shroud and fan guard, which help to increase cooling efficiency and reduce fan noise. The product is an ideal solution for any application that requires efficient cooling.
The specific data is subject to PDF, and the above content is for reference