ATS-10A-05-C3-R0

Thermal - Heat Sinks: ATS-10A-05-C3-R0 Application Field and Working Principle

Heat sinks are commonly used in electronics to dissipate heat generated by circuits or components. In addition to this basic cooling application, they can also have the benefit of extending the operating life of components by reducing the thermal stress and preventing thermal runaway in some cases. The thermal management system of many electronic devices largely depends on the use of effective heat sinking to handle excessive heat. To that end, there are countless different types and styles of heat sinks to choose from. In this article, we will be focusing on one particular type, the ATS-10A-05-C3-R0 for use in electronics. We will cover the application field and working principle.

Application Field

The ATS-10A-05-C3-R0 is designed for use in electronics. This heat sink model is constructed with a frame made of extruded aluminum alloy, which supports high strength and Anti-Corrosion Strength. The aluminum fins have a 9-10-mm center-to-center pitch, with a fin height of 7-10mm. The fins are arranged in an angle pattern that ensures low air resistance and a large cooling area. Overall, the ATS-10A-05-C3-R0 has a compact design ideal for applications with limited space.

The ATS-10A-05-C3-R0 is designed for use with microprocessors, CPUs, digital signal processors, and other such components. It is designed to be used in a variety of applications, from consumer electronics and digital home appliances to automotive and industrial applications. It is especially beneficial in applications where high performance is required and higher-power components may be present.

Working Principle

The ATS-10A-05-C3-R0 works on the principle of heat dissipation. Heat sinks typically have long, straight fins set in a pattern, with a lot of surface area exposed to air to offer maximum radiative cooling. The fins absorb heat from the component being cooled, and the air around the fin absorbs the heat from the fin. This effect is then augmented by air passing over the fins and radiating the trapped heat away from the surface.

The ATS-10A-05-C3-R0 also makes use of a fan that can be manually adjusted to provide additional cooling. The fan helps increase the rate of air passing over the fins, which results in quick heat dissipation. The fan can be adjusted to either increase or decrease the speed of airflow over the heat sink.

Conclusion

Heat sinks are essential in thermal management systems as they provide a way of dissipating heat produced by electronics components. The ATS-10A-05-C3-R0 is designed specifically for electronics to provide an efficient heat dissipation solution. It is constructed of aluminum alloy for a lightweight, yet effective, design. It supports a 9-10-mm center-to-center pitch and comes with a fan to supplement passive radiative cooling. This heat sink is suitable for a variety of applications, from consumer electronics to automotive and industrial.