| Allicdata Part #: | ATS-10A-107-C1-R1-ND |
| Manufacturer Part#: |
ATS-10A-107-C1-R1 |
| Price: | $ 4.38 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-107-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.94443 |
| 30 +: | $ 3.72519 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10A-107-C1-R1 is an active thermal module that is used to transfer, store, and dissipate heat from electronic components. As a thermal - heat sink, it has an effective thermal conductivity, allowing it to maintain a steady state temperature profile, which is ideal for maximizing the performance of electrical components. This thermal module is also designed to dissipate heat from computer chips, displays, and other heat generating components.
This thermal module is also known as an active heat sink, as it actively transfers, stores, and dissipates the heat. It is made of a high-grade aluminum alloy, providing strong thermal conductivity and excellent heat dissipation capacity. The shell of the thermal module is coated with a layer of heat-dissipation coating which helps reduce the temperature variation of the internal components.
ATS-10A-107-C1-R1 application field is primarily for electronic components, such as computers or other equipment, that require sufficient cooling or dissipation of excess heat. The device is designed to effectively manage heat and prevent failure of the equipment. It can also be used to improve system performance, efficiency, and reliability.
The working principle of this thermal module is based on two main components. The active part consists of two parts, wherein one is an immersion fluid, which is filled with a heat sink material, such as copper or aluminum, to absorb the heat from the component. The other is a liquid nitrogen cooling system, which is responsible for cooling down the heat sink material and controlling the amount of heat dissipated from the device. The passive part comprises of the housing, which is made from aluminum alloy and acts as an insulating layer.
The cooling system works by using the liquid nitrogen to absorb heat from the components and draw the heat away from the device. The heat is then absorbed by the active portion of the thermal module. This is converted into thermal energy and stored in the module\'s heat exchanger. This thermal energy is then used to transfer thermal energy back to the component when needed. This ensures that the temperature of the component remains constant, as the temperature of the device itself is maintained within a given range.
By utilizing this thermal module, the heat generated from the electronic components can be dissipated safely. This improves the performance, efficiency, and reliability of the entire system, thereby increasing the lifetime of the equipment. This thermal module also prevents the occurrence of overheating, which is a common problem in electronic components.
The specific data is subject to PDF, and the above content is for reference