ATS-10A-111-C1-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.362" (60.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.72°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-10A-111-C1-R1 Heat Sinks

Heat sinks are an essential component of many electronic devices. They are used to dissipate heat away from sensitive components and help keep the electronic devices running at optimal temperature levels. ATS-10A-111-C1-R1 heat sinks are designed to meet the needs of most common applications requiring thermal management.

Application Fields and Working Principles of ATS-10A-111-C1-R1 Heat Sinks

ATS-10A-111-C1-R1 heat sinks are typically used in industrial and transportation applications where there is a need for high power dissipation. The heat sinks are designed to dissipate as much heat as possible while still maintaining an acceptable thermal design envelope. The heat sinks are constructed using a combination of aluminum and metal alloy to provide a strong and thermally conductive surface.The heat sinks are designed with a two-stage design process. The first stage is to absorb and contain the heat generated by the device. The second stage is to dissipate the heat away from the device to the surrounding environment. The heat sinks use fins with a large surface area to maximize the dissipation of heat. The fins are designed to be as large as possible to ensure that there is minimal pressure drop when air passes through them. Additionally, the heat sinks use an advanced thermal diffusion effect to maximize the thermal transfer from the device to the fins.The heat sinks are also designed to be efficient and reliable. The fins are designed to be highly efficient and keep the device at an optimal working temperature. The heat sinks also have an extended life-span as they are designed to withstand long-term exposure to high temperatures without losing their efficiency or reliability.

Conclusion

In conclusion, ATS-10A-111-C1-R1 heat sinks are an ideal choice for a wide variety of industrial and transportation applications where reliable and efficient thermal management is a must. The two-stage design ensures maximum heat dissipation and the advanced thermal diffusion effect keep the device cooled off, while the efficient fins maintain a consistent working temperature. With their strong and thermally conductive construction, the ATS-10A-111-C1-R1 heat sinks are well-suited for a variety of demanding applications.

The specific data is subject to PDF, and the above content is for reference