ATS-10A-131-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are a type of component used in applications which require heat to be dissipated efficiently. An example of this would be high-end desktop PCs which require an adequate heat-sink to ensure that the CPU does not overheat and malfunction. The ATS-10A-131-C1-R0 is a type of heat-sink designed specifically for use in high-end PC applications.

ATS-10A-131-C1-R0 Application Field and Working Principle

The ATS-10A-131-C1-R0 is a type of heat-sink produced for use in high-end laptop applications. It is specifically designed to provide efficient and reliable heat dissipation, and its aluminum fins are of a particularly fine type, allowing for maximum heat transfer to the surrounding air. The ATS-10A-131-C1-R0 heat-sink also features a unique hollow-core design which helps to ensure that the heat generated by the PC is efficiently dissipated.The ATS-10A-131-C1-R0 works by dissipating heat via the aluminum fins which make up its core structure. The heat-sink utilizes a combination of thermal conduction and thermal convection to dissipate heat from the PC. The convection process is vital, as it ensures that the heat is absorbed from the air surrounding the laptop and eventually dissipated elsewhere. In addition, the fins are designed to provide increased surface area, which provides additional effective heat dispersion.The ATS-10A-131-C1-R0 heat-sink is also specially designed for the laptop device, as it is able to fit snugly against the side of the laptop and provide optimal cooling performance. It is also designed to provide a secure and durable fit, minimizing the risk of overheating or damage from vibration.

Conclusion

The ATS-10A-131-C1-R0 heat-sink is an excellent choice for applications which require efficient and reliable heat dissipation. Its hollow-core design and aluminum fins make it an ideal choice for high-end laptop applications. It provides effective heat conduction and convection, and its secure and durable fit ensures that it is able to provide optimal cooling performance. Thermal - Heat Sinks such as the ATS-10A-131-C1-R0 are increasingly becoming a popular choice for laptops, as they provide superior cooling performance while also helping to minimize the risk of overheating.

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