| Allicdata Part #: | ATS16976-ND |
| Manufacturer Part#: |
ATS-10A-163-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-163-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important engineering consideration in the development and production of complex electronic, mechanical, and automation systems. Thermal heat sinks are essential components in modern digital devices, allowing them to dissipate heat rapidly and maintain cooler temperatures in the working environment. The ATS-10A-163-C2-R0 is a high-performance heat sink designed to meet the needs of these digital devices.
The ATS-10A-163-C2-R0 Heat Sink is made up of several components, designed to efficiently dissipate heat. The heat sink itself is composed of an aluminum base, aluminum fins, and steel mounting screws. The aluminum base acts as the thermal interface between the heat sink and the component, transferring heat away from the component. The fins act to greatly increase the surface area of the heat sink, allowing it to dissipate heat more quickly and effectively. Finally, the mounting screws are used to attach the heat sink to the component to ensure a secure fit.
The ATS-10A-163-C2-R0 Heat Sink is designed to be used in a variety of applications. It is often used in CPUs, GPUs, power transistors, and other high-power devices that require fast heat dissipation. In these devices, it is essential to maintain a reliable temperature, and the ATS-10A-163-C2-R0 is designed for this purpose. By allowing these devices to operate under cooler temperatures, the ATS-10A-163-C2-R0 helps to extend their life and reduce the risk of component failure.
The ATS-10A-163-C2-R0 Heat Sink is designed to operate under minimal airflow, making it suitable for tight spaces in custom builds. It is capable of dissipating up to 10 watts of heat, a significant amount when compared to other heat sinks. Additionally, the ATS-10A-163-C2-R0 is lightweight and easy to install. This makes it a great solution for static applications and projects that require frequent maintenance.
The ATS-10A-163-C2-R0 Heat Sink has been designed to ensure optimal performance. Its construction includes a heat conducting pad that maximizes the thermal interface between the heat sink and the component, and its fin design allows for efficient heat dissipation. Additionally, the aluminum fins are coated with a corrosion-resistant material, making them extremely reliable and durable.
In conclusion, the ATS-10A-163-C2-R0 Heat Sink is an ideal solution for devices that require effective heat dissipation in tight spaces. This reliable, high-performance heat sink is easy to install and efficient at dissipating heat, making it a great choice for custom electronics and automation systems. With its robust construction and efficient design, the ATS-10A-163-C2-R0 is sure to meet all of your thermal management needs.
The specific data is subject to PDF, and the above content is for reference