| Allicdata Part #: | ATS17005-ND |
| Manufacturer Part#: |
ATS-10A-19-C2-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-19-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management is an important component of many electronic systems. Heat sinks are widely used in electronic equipment to dissipate heat generated by components. The ATS-10A-19-C2-R0 is a heat sink designed for power amplifiers, processors, and other power components.
The ATS-10A-19-C2-R0 is a two-piece heat sink. The top piece is made of aluminum, which is used to draw heat from the heat-generating component. The bottom piece is made of copper to effectively dissipate heat to the surrounding environment. The two pieces are held together with a copper base that sits between them, connecting them in a uniform fashion.
The design of the ATS-10A-19-C2-R0 heat sink ensures efficient transfer and dissipation of heat from the component to the environment. This is accomplished by maximizing the contact area between the component and the heat sink. The aluminum top covers the component to allow as much of the component to come in direct contact with the heat sink as possible, while the copper base ensures that heat is dispersed evenly across the surface of the metal. The copper bottom also acts as a thermal bridge, maintaining the temperature difference between the component and the environment.
The ATS-10A-19-C2-R0 heat sink is designed to provide efficient cooling for power amplifiers, processors and other power components. The aluminum top transfers heat from the component, while the copper bottom disperses the heat efficiently to the surroundings. It is a reliable and effective solution for managing the heat generated by components in electronic devices. The ATS-10A-19-C2-R0 is a cost-effective and efficient way to ensure that components function properly and do not overheat.
The specific data is subject to PDF, and the above content is for reference