| Allicdata Part #: | ATS-10A-190-C3-R0-ND |
| Manufacturer Part#: |
ATS-10A-190-C3-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-190-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.07169 |
| 30 +: | $ 3.84531 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electrical components is essential in order to ensure their safe operation. Heat sinks are essential components in the thermal management system and have been used to dissipate heat from electronic components for decades. The ATS-10A-190-C3-R0 is a high-performance heat sink designed to dissipate heat from electrical components running at high temperatures.
The ATS-10A-190-C3-R0 heat sink consists of a copper base that is attached to an aluminum fin structure for maximum heat dissipation. The fin structure is designed to promote air flow through the sink to help cool the components it is attached to. The copper base provides excellent thermal conductivity to transfer heat away from the source, to the fins, and dissipate it in the surrounding environment. The ATS-10A-190-C3-R0 also includes thermal interface material to ensure the maximum thermal transfer between the heat source and the sink.
The ATS-10A-190-C3-R0 heat sink can handle temperatures up to 200°C and provides exceptionally high thermal performance. It is suitable for most applications that require thermal management and is ideal for high power, high temperature components, such as processors, power semiconductors, and LEDs. The heat sink is lightweight and compact, making it easy to install in tight spaces.
The ATS-10A-190-C3-R0 heat sink’s working principle is based on conduction. The heat generated by the component is transferred to the copper base of the heat sink, and then it is transferred to the aluminum fins. The aluminum fins promote air flow through the fins to help conduct the heat away from the base and into the surrounding environment. The copper base helps conduct the heat away from the source and to the fins for efficient thermal management.
The ATS-10A-190-C3-R0 heat sink is an excellent choice for components running at high temperatures and requiring effective thermal management. It offers superior performance compared to other thermal management solutions and is ideal for applications where space is limited. The heat sink is easy to install and provides reliable performance in all temperatures and environments.
The specific data is subject to PDF, and the above content is for reference