| Allicdata Part #: | ATS-10A-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-10A-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are essential components in cooling technology and have been around in various variations for many years. The ATS-10A-28-C3-R0 is a type of Heat Sink designed to provide maximum thermal performance and reliability. This Heat Sink is widely used in consumer electronics, industrial electronics, medical electronics, aerospace, defense and more.
The ATS-10A-28-C3-R0 incorporates a patented design which offers a combination of a compactly arranged aluminum base and a finned top plate. This configuration allows for an efficient air-flow design which is ideal for thermal conditions where cooling air can pass directly over the finned top plate and through the Heat Sink. This Heat Sink is designed to provide maximum airflow and provide a higher amount of cooling performance than any other type of Heat Sink currently available.
The ATS-10A-28-C3-R0 also has an optimized shape and size for optimal thermal performance. It has an extruded aluminum base and finned aluminum top plate for superior heat dissipation. Together, these features ensure that the Heat Sink is able to efficiently transfer heat away from high-power CPUs, GPUs, and other electronics.
The ATS-10A-28-C3-R0 also features a robust and proven clamping mechanism. This feature ensures that the heat sink stays securely attached to the component even in harsh environments. The clamp also has a quick release feature which allows the heat sink to be easily removed for maintenance. This makes it easier to clean and replace the Heat Sink should the need arise.
The ATS-10A-28-C3-R0 has a variety of mounting options to accommodate different components and applications. The Heat Sink can be directly attached to a printed circuit board or to any flat surface using the included hardware. This allows the Heat Sink to be used in both mobile and stationary applications. Additionally, the included thermal pads provide an extra layer of insulation and protection from shorts.
In conclusion, the ATS-10A-28-C3-R0 is an excellent choice for thermal management solutions. It offers superior performance and reliability, as well as robust and proven clamping mechanisms for secure attachment. It has a variety of mounting options and is suitable for both mobile and stationary applications. With its rugged design and robust construction, the ATS-10A-28-C3-R0 is a great choice for any thermal management application.
The specific data is subject to PDF, and the above content is for reference