| Allicdata Part #: | ATS-10A-39-C3-R0-ND |
| Manufacturer Part#: |
ATS-10A-39-C3-R0 |
| Price: | $ 6.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-39-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.43627 |
| 30 +: | $ 5.13429 |
| 50 +: | $ 4.83235 |
| 100 +: | $ 4.53033 |
| 250 +: | $ 4.22831 |
| 500 +: | $ 3.92629 |
| 1000 +: | $ 3.85078 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical element of the design of any electronic device, and heat sinks are an essential part of the thermal management strategy. There are various types and sizes of heat sinks available, each of which are designed to suit specific applications. The ATS-10A-39-C3-R0 is a heat sink from Amphenol Advanced Sensors that is designed for high power device designs. This heat sink is a cost-effective solution for device thermal management, providing superior thermal performance.
The ATS-10A-39-C3-R0 is designed to provide thermal dissipation for high-power density applications where high performance and reliability are required. This heat sink is made from aluminum, with a larger surface area to dissipate heat, and is designed with a compact footprint for easy integration. The heat sink features a profile that maximizes airflow, with included mounting hardware for easy installation. This heat sink is RoHS compliant, and is designed with a thermal resistance of 0.72°C/W.
The ATS-10A-39-C3-R0 is an effective solution for high power device designs, and is well suited for use in a variety of applications. This heat sink is designed to manage the thermal load of high power density devices such as servers, routers, and ASICs. It is ideal for applications where efficient thermal management is necessary for overall system reliability due to its superior thermal performance. Additionally, the heat sink is also well suited for use in applications with large ambient temperatures, such as automotive, aerospace, and medical applications. The heat sink is also designed for use in energy efficiency-focused applications, providing efficient heat dissipation for reduced power consumption in these applications.
The ATS-10A-39-C3-R0 is designed to provide superior thermal performance for high power density devices. This heat sink is designed with an innovative profile that increases airflow, allowing for faster heat transfer while increasing the surface area of the heat sink. The larger surface area of the heat sink allows for improved thermal performance and greater overall heat dissipation. Additionally, the heat sink features a compact design, allowing it to be easily integrated into a wide variety of applications. Finally, the heat sink is designed with an optimal thermal resistance of 0.72°C/W, providing efficient heat dissipation for reduced power consumption.
The ATS-10A-39-C3-R0 is an ideal solution for high power device designs, providing superior thermal performance and optimal power efficiency. This heat sink is designed for use in a variety of applications, including servers, routers, ASICs, automotive, aerospace, and medical applications. The ATS-10A-39-C3-R0 is designed with an innovative profile that increases airflow and maximizes surface area for superior thermal performance. The heat sink is designed with a compact footprint for easy integration and an optimal thermal resistance of 0.72°C/W for efficient heat dissipation and reduced power consumption. The ATS-10A-39-C3-R0 is a cost-effective solution for device thermal management, providing superior thermal performance and optimal power efficiency.
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