| Allicdata Part #: | ATS17075-ND |
| Manufacturer Part#: |
ATS-10A-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10A-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to Thermal – Heat Sinks
Heat sinks are devices used to quickly dissipate heat in order to reduce operating temperatures. Heat sinks are used in many applications, such as computers, electronics, and other manufacturing operations where excess heat must be removed from components to ensure their proper operation. The most common type of heat sink is a metal device that is designed to disperse heat by conducting and radiating it away from a component. In many cases, a fan or other air-moving device is used in conjunction with the heat sink to greatly increase its effectiveness. Heat sinks are commonly used in computers, driverless LED lighting, and other electronic components, helping to prevent damage from heat buildup.
ATS-10A-80-C2-R0 Application Field and Working Principle
ATS-10A-80-C2-R0 is a type of heat sink specifically designed for high-end embedded applications. It features an advanced rectangular design that enables the device to dissipate heat more efficiently than traditional square shapes. Additionally, the ATS-10A-80-C2-R0 has a low profile, making it well-suited for tight spaces, and has a total depth of 24.5 mm. For improved thermal performance, the heat sink has an extruded aluminum construction with anodized black fins. These fins are also designed to be as light as possible, while providing optimal cooling performance. The ATS-10A-80-C2-R0 also features a fin base which is made of copper, allowing for better heat transfer.
The ATS-10A-80-C2-R0 also has a unique cooling system which utilizes four core airflow channels. This design helps to maintain optimal airflow within the device, ensuring efficient heat dissipation. Additionally, the heat sink can also be equipped with a fan for an extra layer of cooling. This fan can either be a PWM regulated or DC fan and operates at a maximum speed of 76.5CFM. In terms of performance, the ATS-10A-80-C2-R0 has a Thermal Resistance of 0.19°C/W, making it suitable for high-end applications with demanding performance requirements.
Overall, the ATS-10A-80-C2-R0 is a well-designed and efficient heat sink that is perfect for high-end embedded applications. Its advanced rectangular design ensures efficient thermal dissipation, while its lightweight construction and low profile make it ideal for tight spaces. Additionally, its four core airflow channels and optional fan provide extra cooling performance when needed. With its impressive thermal resistance of 0.19°C/W, the ATS-10A-80-C2-R0 is a great option for those who need reliable and powerful thermal performance.
The specific data is subject to PDF, and the above content is for reference