ATS-10B-101-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.77°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-10B-101-C3-R0 Thermal - Heat SinksThermal - Heat Sinks are key components of any electronic system, and the ATS-10B-101-C3-R0 is a great example of this technology. Heat sinks are mechanical structures used to reduce the temperature of hot components in an electronic circuit. ATS-10B-101-C3-R0 is a type of heat sink that delivers reliable performance in a variety of applications.Application Field of ATS-10B-101-C3-R0 Thermal - Heat SinksThe ATS-10B-101-C3-R0 thermal - heat sinkand is widely used in industrial, medical, computer, home appliances, automotive and other electronic applications. Its 8-pin design makes it an ideal choice for space-constrained applications, such as gaming consoles and laptops. The heat sink offers superior cooling performance, enabling system designers to reduce noise and component temperatures, while providing reliable reliability under varying conditions.Working Principle of ATS-10B-101-C3-R0 Thermal - Heat SinksThe ATS-10B-101-C3-R0 thermal - heat sink uses a thermodynamic technology called convection. This technology relies on the circulation of air between a hot component and the heat sink itself. The air is drawn in by a fan, which circulates the air around the component, thus dissipating the heat. The hot air is then drawn away from the component and is expelled out of the system. This process is repeated until the temperature of the hot component is lowered, reducing the amount of noise it emits.The ATS-10B-101-C3-R0 thermal - heat sink also utilizes two other thermal technologies - heat pipes and heat spreaders. Heat pipes are finned copper tubes that move heat quickly away from the component. Heat spreaders are designed to evenly distribute the heat produced by components.In addition to the convection and thermal technologies used by the ATS-10B-101-C3-R0, the heat sink also utilizes a special material called a thermal interfacechiller (TIC). This material is designed to reduce the temperature of components by up to five degrees Celsius. The TIC is also designed to dissipate heat more efficiently than other heat sink materials, making it an ideal choice for applications that require peak performance.Finally, the ATS-10B-101-C3-R0 is designed with robust construction to ensure reliability in harsh environments. The heat sink is constructed of high-quality aluminum alloy and anodized to prevent corrosion. The anodizing also ensures the heat sink remains consistent in its thermal performance over time.ConclusionThe ATS-10B-101-C3-R0 thermal - heat sink is an excellent choice for those looking for reliable cooling performance under varied conditions. Its use of convection, heat pipes and heat spreaders, along with the thermal interface chiller, allows it to dissipate heat quickly and efficiently. The robust construction ensures reliability in harsh environments. With all these features, the ATS-10B-101-C3-R0 is an ideal heat sink for industrial, medical, computer, home appliance, automotive and other electronic applications.

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