| Allicdata Part #: | ATS-10B-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-10B-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal or heat sinks are devices that are designed to dissipate heat away from components and make them cool. Heat sinks are often used in computers, audio-video systems, industrial applications, telecommunications, lighting, automotive, and many other electronic device applications. The ATS-10B-12-C3-R0 is a type of thermal or heat sink, specifically designed for telecom applications. In this article, we\'ll look at its application field and working principle.
What is the ATS-10B-12-C3-R0?
The ATS-10B-12-C3-R0 is a high-efficiency aluminum base thermal or heat sink and is designed for cooling modern telecom equipment. The device features a low profile design and can be used for cooling of FPGA, SoC, ASIC, and other telecom equipment. Its maximum working temperature is 85°C and its overall dimensions are 10.8" (L) x 6.5" (W) x 0.5" (H).
Applications of the ATS-10B-12-C3-R0
The ATS-10B-12-C3-R0 is designed for use in a wide range of telecom applications, including the following:
- Cable TV systems
- Computer networks
- Telecommunications services
- Fiber optic networks
- Mobile telephony networks
- Broadband access networks
- Data transmission networks
- Wireless communication networks
- Satellite communications systems
The device is also suitable for cooling other electronic devices and components, such as power supplies, circuit boards, LED lighting arrays, and more.
Working Principle of the ATS-10B-12-C3-R0
The ATS-10B-12-C3-R0 operates on an entirely natural convection-based cooling process. The heat generated by the telecom equipment is dissipated from fin surfaces rapidly due to the low thermal resistance (0.29 ±0.04°C/W) of the device. The heat sink is designed with a long, shallow profile that gives it a high ratio of convective heat transfer performance, while its aluminum base ensures optimal heat dissipation. This helps to ensure that components are well cooled and without the need for additional cooling systems, such as fans.
Conclusion
The ATS-10B-12-C3-R0 is a high-efficiency aluminum thermal or heat sink designed for telecom applications. It is suitable for cooling a range of components and electronic devices, such as FPGA, SoC, ASIC, power supplies, circuit boards, LED lighting arrays, and more. The device operates on a natural convection-based cooling process, with its low thermal resistance helping to ensure efficient cooling and great thermal management.
The specific data is subject to PDF, and the above content is for reference