| Allicdata Part #: | ATS17167-ND |
| Manufacturer Part#: |
ATS-10B-157-C2-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-10B-157-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.10130 |
| 10 +: | $ 3.99042 |
| 25 +: | $ 3.76891 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in modern electronic systems. They are utilized to keep system components such as micro-processors, power switching components and other heat-sensitive elements from becoming too hot or overheating. Heat sinks act to disperse the heat generated from these components and protect them from thermal damage.
The ATS-10B-157-C2-R0 is a two-piece, low-profile heat sink designed to dissipate heat from a variety of components. The unique design of the ATS-10B-157-C2-R0 allows it to be customized to fit in a range of application areas.
The primary components of the ATS-10B-157-C2-R0 are the base plate and the heat sink. The base plate is made from stainless steel and features an array of pre-drilled threaded pockets that are designed to fit most components. The heat sink is made of high-performance graphite and is designed to dissipate heat away from the base plate quickly and efficiently.
The ATS-10B-157-C2-R0 is an excellent solution for applications where space and heat dissipation are key considerations. The base plate and heat sink are easily mounted to the components with standard screws, and the two pieces are designed to work together efficiently. Additionally, the heat sink is designed to be quiet and low profile, making it suitable for applications that require a quiet operation. The ATS-10B-157-C2-R0 can also be used in areas with limited airflow, thanks to its low profile and efficient thermal dissipation.
The working principle of the ATS-10B-157-C2-R0 is based on the principles of convection and conduction. The base plate consists of a series of plates that make direct contact with the components. The heat generated by these components is dissipated through the base plate to the heat sink. The heat is then transferred to the air surrounding the heat sink through convection. This process is repeated until the desired temperature is achieved.
The ATS-10B-157-C2-R0 is an ideal solution for cooling a variety of components in applications such as medical, industrial, automotive, and telecom. Its low-profile design and wide range of custom mounting options make it an ideal solution for a wide variety of applications. It is also easy to install, making it suitable for installations with limited space or limited access. The ATS-10B-157-C2-R0 is an excellent choice for applications that require reliable and efficient thermal dissipation.
The specific data is subject to PDF, and the above content is for reference
ATS-10B-157-C2-R0 Datasheet/PDF