| Allicdata Part #: | ATS17177-ND |
| Manufacturer Part#: |
ATS-10B-166-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10B-166-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management products are an important component of many electronic devices. Properly designed, constructed, and implemented thermal management systems ensure the safe operation of the device and its longevity. The ATS-10B-166-C2-R0 is a type of thermal management product that can provide exceptional cooling performance for a wide range of applications.
The ATS-10B-166-C2-R0 is an advanced thermal management solution designed for a wide variety of applications. It is a Heat Sink that utilizes an assembly of copper fins and an aluminum alloy base to provide highly efficient thermal conductivity. The alloy base is designed to provide superior heat dissipation, and the copper fins help to dissipate heat from the components that are used in various electronic devices. The fins are designed to be tightly packed, allowing for maximum airflow and heat dissipation.
The ATS-10B-166-C2-R0 is an ideal thermal management solution for any electronic device that requires efficient cooling. The device is designed to work in unison with a fan or other cooling system, and the fins help to reduce the temperature of components inside the device. Additionally, the design of the ATS-10B-166-C2-R0 allows for easy installation in many applications.
The working principle of the ATS-10B-166-C2-R0 is based on a simple concept of heat transfer and dissipation. The fins on the heat sink are designed to dissipate heat by transferring the heat from the components to the ambient air. As the heat is transfered to the surrounding air, the fins absorb the heat and in turn help to keep the components inside the device cool. This allows for more efficient operation of the device.
The ATS-10B-166-C2-R0 is a versatile and efficient thermal management product that can be used in various applications. It is a great option for cooling down high-power components such as CPUs, GPUs, and other processors. Additionally, it is also suitable for applications such as power supply units and storage devices. This heat sink is designed to provide excellent cooling performance for all types of electronics and can be used in a wide variety of applications.
In summary, the ATS-10B-166-C2-R0 is a highly efficient thermal management device that is designed for a wide range of applications. It utilizes an alloy base and copper fins to dissipate heat from components and keep them at an optimum operating temperature. This heat sink is also easy to install and can be used in many different types of applications. If you are looking for an effective and efficient cooling system for your electronic devices, the ATS-10B-166-C2-R0 is an excellent option.
The specific data is subject to PDF, and the above content is for reference